skip to main content
DOE Patents title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Direct current sputtering of boron from boron/boron mixtures

Abstract

A method for coating a substrate with boron by sputtering includes lowering the electrical resistance of a boron-containing rod to allow electrical conduction in the rod; placing the boron-containing rod inside a vacuum chamber containing substrate material to be coated; applying an electrical potential between the boron target material and the vacuum chamber; countering a current avalanche that commences when the conduction heating rate exceeds the cooling rate, and until a steady equilibrium heating current is reached; and, coating the substrate material with boron by sputtering from the boron-containing rod. 2 figures.

Inventors:
; ;
Issue Date:
OSTI Identifier:
6620836
Patent Number(s):
5372686 A
Application Number:
PPN: US 8-067967
Assignee:
Dept. of Energy, Washington, DC (United States) PTO; EDB-95-029737
DOE Contract Number:  
AC02-76CH03073
Resource Type:
Patent
Resource Relation:
Patent File Date: 27 May 1993
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; BORON; VACUUM COATING; ELECTRIC CONDUCTIVITY; SPUTTERING; VACUUM SYSTEMS; DEPOSITION; ELECTRICAL PROPERTIES; ELEMENTS; PHYSICAL PROPERTIES; SEMIMETALS; SURFACE COATING 360601* -- Other Materials-- Preparation & Manufacture

Citation Formats

Timberlake, J.R., Manos, D., and Nartowitz, E. Direct current sputtering of boron from boron/boron mixtures. United States: N. p., 1994. Web.
Timberlake, J.R., Manos, D., & Nartowitz, E. Direct current sputtering of boron from boron/boron mixtures. United States.
Timberlake, J.R., Manos, D., and Nartowitz, E. Tue . "Direct current sputtering of boron from boron/boron mixtures". United States.
@article{osti_6620836,
title = {Direct current sputtering of boron from boron/boron mixtures},
author = {Timberlake, J.R. and Manos, D. and Nartowitz, E.},
abstractNote = {A method for coating a substrate with boron by sputtering includes lowering the electrical resistance of a boron-containing rod to allow electrical conduction in the rod; placing the boron-containing rod inside a vacuum chamber containing substrate material to be coated; applying an electrical potential between the boron target material and the vacuum chamber; countering a current avalanche that commences when the conduction heating rate exceeds the cooling rate, and until a steady equilibrium heating current is reached; and, coating the substrate material with boron by sputtering from the boron-containing rod. 2 figures.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1994},
month = {12}
}