Multiwire conductor having increased interwire resistance and good mechanical stability and method for making same
Abstract
An improved multiwire conductor of the type which is mechanically stabilized by a solder filler. A solder filled conductor is heated to a temperature sufficient to make the solder brittle, but below the melting point of the solder. While still hot, the conductor is flexed, causing the solder to separate from the wires comprising the conductor, thereby increasing the interwire resistance. In one embodiment the conductor may be heated to a temperature above the eutectic temperature of the solder so that a controlled amount of solder is removed. The subject invention is particularly suited for use with braided, ribbon-type, solder filled superconductors.
- Inventors:
- Issue Date:
- OSTI Identifier:
- 6570340
- Application Number:
- ON: DE83006864
- Assignee:
- ERA-08-018419; EDB-83-051196
- DOE Contract Number:
- AC02-76CH00016
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS; SUPERCONDUCTING WIRES; DESIGN; FABRICATION; WIRES; 420201* - Engineering- Cryogenic Equipment & Devices
Citation Formats
Luhman, T, and Klamut, C. Multiwire conductor having increased interwire resistance and good mechanical stability and method for making same. United States: N. p., 1982.
Web.
Luhman, T, & Klamut, C. Multiwire conductor having increased interwire resistance and good mechanical stability and method for making same. United States.
Luhman, T, and Klamut, C. Mon .
"Multiwire conductor having increased interwire resistance and good mechanical stability and method for making same". United States.
@article{osti_6570340,
title = {Multiwire conductor having increased interwire resistance and good mechanical stability and method for making same},
author = {Luhman, T and Klamut, C},
abstractNote = {An improved multiwire conductor of the type which is mechanically stabilized by a solder filler. A solder filled conductor is heated to a temperature sufficient to make the solder brittle, but below the melting point of the solder. While still hot, the conductor is flexed, causing the solder to separate from the wires comprising the conductor, thereby increasing the interwire resistance. In one embodiment the conductor may be heated to a temperature above the eutectic temperature of the solder so that a controlled amount of solder is removed. The subject invention is particularly suited for use with braided, ribbon-type, solder filled superconductors.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Mon Mar 15 00:00:00 EST 1982},
month = {Mon Mar 15 00:00:00 EST 1982}
}
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