Multiwire conductor having greatly increased interwire resistance and method for making same
Abstract
An improved multiwire conductor of the type which is mechanically stabilized by a tin based solder filler is described. A solder filled conductor is heated to a temperature above its melting point for a period long enough to allow a substantial amount of copper to be dissolved from the wires comprising the conductor. The copper forms the brittle intermetallic compound Cu/sub 5/Sn/sub 6/ with tin in the solder. After cooling the conductor is flexed causing a random cracking of the solder, and thereby increasing the interwire resistance of the conductor. The subject invention is particularly adapted for use with braided, ribbon-type solder filled superconductors.
- Inventors:
- Issue Date:
- OSTI Identifier:
- 6535780
- Application Number:
- ON: DE83006866
- Assignee:
- Dept. of Energy
- DOE Contract Number:
- AC02-76CH00016
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS; SUPERCONDUCTING WIRES; FABRICATION; COPPER ALLOYS; INTERMETALLIC COMPOUNDS; MANUFACTURING; SUPERCONDUCTING MAGNETS; TIN; TIN ALLOYS; ALLOYS; ELECTRICAL EQUIPMENT; ELECTROMAGNETS; ELEMENTS; EQUIPMENT; MAGNETS; METALS; SUPERCONDUCTING DEVICES; WIRES; 420201* - Engineering- Cryogenic Equipment & Devices
Citation Formats
Luhman, T, and Suenaga, M. Multiwire conductor having greatly increased interwire resistance and method for making same. United States: N. p., 1982.
Web.
Luhman, T, & Suenaga, M. Multiwire conductor having greatly increased interwire resistance and method for making same. United States.
Luhman, T, and Suenaga, M. Mon .
"Multiwire conductor having greatly increased interwire resistance and method for making same". United States.
@article{osti_6535780,
title = {Multiwire conductor having greatly increased interwire resistance and method for making same},
author = {Luhman, T and Suenaga, M},
abstractNote = {An improved multiwire conductor of the type which is mechanically stabilized by a tin based solder filler is described. A solder filled conductor is heated to a temperature above its melting point for a period long enough to allow a substantial amount of copper to be dissolved from the wires comprising the conductor. The copper forms the brittle intermetallic compound Cu/sub 5/Sn/sub 6/ with tin in the solder. After cooling the conductor is flexed causing a random cracking of the solder, and thereby increasing the interwire resistance of the conductor. The subject invention is particularly adapted for use with braided, ribbon-type solder filled superconductors.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Mon Mar 15 00:00:00 EST 1982},
month = {Mon Mar 15 00:00:00 EST 1982}
}
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