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Title: Multiwire conductor having greatly increased interwire resistance and method for making same

Abstract

An improved multiwire conductor of the type which is mechanically stabilized by a tin based solder filler is described. A solder filled conductor is heated to a temperature above its melting point for a period long enough to allow a substantial amount of copper to be dissolved from the wires comprising the conductor. The copper forms the brittle intermetallic compound Cu/sub 5/Sn/sub 6/ with tin in the solder. After cooling the conductor is flexed causing a random cracking of the solder, and thereby increasing the interwire resistance of the conductor. The subject invention is particularly adapted for use with braided, ribbon-type solder filled superconductors.

Inventors:
;
Issue Date:
OSTI Identifier:
6535780
Application Number:
ON: DE83006866
Assignee:
Dept. of Energy EDB-83-043623
DOE Contract Number:  
AC02-76CH00016
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS; SUPERCONDUCTING WIRES; FABRICATION; COPPER ALLOYS; INTERMETALLIC COMPOUNDS; MANUFACTURING; SUPERCONDUCTING MAGNETS; TIN; TIN ALLOYS; ALLOYS; ELECTRICAL EQUIPMENT; ELECTROMAGNETS; ELEMENTS; EQUIPMENT; MAGNETS; METALS; SUPERCONDUCTING DEVICES; WIRES; 420201* - Engineering- Cryogenic Equipment & Devices

Citation Formats

Luhman, T., and Suenaga, M. Multiwire conductor having greatly increased interwire resistance and method for making same. United States: N. p., 1982. Web.
Luhman, T., & Suenaga, M. Multiwire conductor having greatly increased interwire resistance and method for making same. United States.
Luhman, T., and Suenaga, M. Mon . "Multiwire conductor having greatly increased interwire resistance and method for making same". United States.
@article{osti_6535780,
title = {Multiwire conductor having greatly increased interwire resistance and method for making same},
author = {Luhman, T. and Suenaga, M.},
abstractNote = {An improved multiwire conductor of the type which is mechanically stabilized by a tin based solder filler is described. A solder filled conductor is heated to a temperature above its melting point for a period long enough to allow a substantial amount of copper to be dissolved from the wires comprising the conductor. The copper forms the brittle intermetallic compound Cu/sub 5/Sn/sub 6/ with tin in the solder. After cooling the conductor is flexed causing a random cracking of the solder, and thereby increasing the interwire resistance of the conductor. The subject invention is particularly adapted for use with braided, ribbon-type solder filled superconductors.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1982},
month = {3}
}