skip to main content
DOE Patents title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Apparatus and method for selective area deposition of thin films on electrically biased substrates

Abstract

An ion beam deposition process for selective area deposition on a polarized substrate uses a potential applied to the substrate which allows the ionized particles to reach into selected areas for film deposition. Areas of the substrate to be left uncoated are held at a potential that repels the ionized particles. 3 figs.

Inventors:
; ;
Issue Date:
Sponsoring Org.:
USDOE; USDOE, Washington, DC (United States)
OSTI Identifier:
6450191
Patent Number(s):
5910220
Application Number:
PPN: US 8-286371
Assignee:
Martin Marietta Energy Systems, Inc., Oak Ridge, TN (United States)
DOE Contract Number:  
AC05-84OR21400
Resource Type:
Patent
Resource Relation:
Patent File Date: 5 Aug 1994
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; DESIGN; ELECTRIC POTENTIAL; ENERGY BEAM DEPOSITION; ION BEAMS; SUBSTRATES; THIN FILMS; BEAMS; DEPOSITION; FILMS; SURFACE COATING; 360101* - Metals & Alloys- Preparation & Fabrication; 360201 - Ceramics, Cermets, & Refractories- Preparation & Fabrication; 360601 - Other Materials- Preparation & Manufacture

Citation Formats

Zuhr, R A, Haynes, T E, and Golanski, A. Apparatus and method for selective area deposition of thin films on electrically biased substrates. United States: N. p., 1999. Web.
Zuhr, R A, Haynes, T E, & Golanski, A. Apparatus and method for selective area deposition of thin films on electrically biased substrates. United States.
Zuhr, R A, Haynes, T E, and Golanski, A. Tue . "Apparatus and method for selective area deposition of thin films on electrically biased substrates". United States.
@article{osti_6450191,
title = {Apparatus and method for selective area deposition of thin films on electrically biased substrates},
author = {Zuhr, R A and Haynes, T E and Golanski, A},
abstractNote = {An ion beam deposition process for selective area deposition on a polarized substrate uses a potential applied to the substrate which allows the ionized particles to reach into selected areas for film deposition. Areas of the substrate to be left uncoated are held at a potential that repels the ionized particles. 3 figs.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1999},
month = {6}
}