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Title: Process system and method for fabricating submicron field emission cathodes

Abstract

A process method and system for making field emission cathodes exists. The deposition source divergence is controlled to produce field emission cathodes with height-to-base aspect ratios that are uniform over large substrate surface areas while using very short source-to-substrate distances. The rate of hole closure is controlled from the cone source. The substrate surface is coated in well defined increments. The deposition source is apertured to coat pixel areas on the substrate. The entire substrate is coated using a manipulator to incrementally move the whole substrate surface past the deposition source. Either collimated sputtering or evaporative deposition sources can be used. The position of the aperture and its size and shape are used to control the field emission cathode size and shape. 3 figs.

Inventors:
;
Issue Date:
Research Org.:
Univ. of California (United States)
Sponsoring Org.:
USDOE, Washington, DC (United States)
OSTI Identifier:
644418
Patent Number(s):
5746634
Application Number:
PAN: 8-627,152
Assignee:
Univ. of California, Oakland, CA (United States)
DOE Contract Number:  
W-7405-ENG-48
Resource Type:
Patent
Resource Relation:
Other Information: PBD: 5 May 1998
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING NOT INCLUDED IN OTHER CATEGORIES; FIELD EMISSION; CATHODES; FABRICATION; SURFACE COATING; SUBSTRATES

Citation Formats

Jankowski, A F, and Hayes, J P. Process system and method for fabricating submicron field emission cathodes. United States: N. p., 1998. Web.
Jankowski, A F, & Hayes, J P. Process system and method for fabricating submicron field emission cathodes. United States.
Jankowski, A F, and Hayes, J P. Tue . "Process system and method for fabricating submicron field emission cathodes". United States.
@article{osti_644418,
title = {Process system and method for fabricating submicron field emission cathodes},
author = {Jankowski, A F and Hayes, J P},
abstractNote = {A process method and system for making field emission cathodes exists. The deposition source divergence is controlled to produce field emission cathodes with height-to-base aspect ratios that are uniform over large substrate surface areas while using very short source-to-substrate distances. The rate of hole closure is controlled from the cone source. The substrate surface is coated in well defined increments. The deposition source is apertured to coat pixel areas on the substrate. The entire substrate is coated using a manipulator to incrementally move the whole substrate surface past the deposition source. Either collimated sputtering or evaporative deposition sources can be used. The position of the aperture and its size and shape are used to control the field emission cathode size and shape. 3 figs.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1998},
month = {5}
}