skip to main content
DOE Patents title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Heating device for semiconductor wafers

Abstract

An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly of light energy sources for emitting light energy onto a wafer. In particular, the light energy sources are positioned such that many different radial heating zones are created on a wafer being heated. For instance, in one embodiment, the light energy sources form a spiral configuration. In an alternative embodiment, the light energy sources appear to be randomly dispersed with respect to each other so that no discernible pattern is present. In a third alternative embodiment of the present invention, the light energy sources form concentric rings. Tuning light sources are then placed in between the concentric rings of light. 4 figs.

Inventors:
Issue Date:
Sponsoring Org.:
USDOE; USDOE, Washington, DC (United States)
OSTI Identifier:
6433732
Patent Number(s):
5930456 A
Application Number:
PPN: US 9-078865
Assignee:
AG Associates, San Jose, CA (United States) SNL; EDB-99-085333
DOE Contract Number:  
AC04-94AL85000
Resource Type:
Patent
Resource Relation:
Patent File Date: 14 May 1998
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; 42 ENGINEERING; DESIGN; HEAT TREATMENTS; LIGHT SOURCES; POSITIONING; SEMICONDUCTOR DEVICES; SEMICONDUCTOR MATERIALS; MATERIALS; RADIATION SOURCES; 360601* - Other Materials- Preparation & Manufacture; 426000 - Engineering- Components, Electron Devices & Circuits- (1990-)

Citation Formats

Vosen, S.R. Heating device for semiconductor wafers. United States: N. p., 1999. Web.
Vosen, S.R. Heating device for semiconductor wafers. United States.
Vosen, S.R. Tue . "Heating device for semiconductor wafers". United States.
@article{osti_6433732,
title = {Heating device for semiconductor wafers},
author = {Vosen, S.R.},
abstractNote = {An apparatus for heat treating semiconductor wafers is disclosed. The apparatus includes a heating device which contains an assembly of light energy sources for emitting light energy onto a wafer. In particular, the light energy sources are positioned such that many different radial heating zones are created on a wafer being heated. For instance, in one embodiment, the light energy sources form a spiral configuration. In an alternative embodiment, the light energy sources appear to be randomly dispersed with respect to each other so that no discernible pattern is present. In a third alternative embodiment of the present invention, the light energy sources form concentric rings. Tuning light sources are then placed in between the concentric rings of light. 4 figs.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1999},
month = {7}
}