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Title: Apparatus for electroplating particles of small dimension

Abstract

The thickness, uniformity, and surface smoothness requirements for surface coatings of glass microspheres for use as targets for laser fusion research are critical. Because of thier minute size, the microspheres are difficult to manipulate and control in electroplating systems. The electroplating apparatus of the present invention addresses these problems by providing a cathode cell having a cell chamber, a cathode and an anode electrically isolated from each other and connected to an electrical power source. During the plating process, the cathode is controllably vibrated along with solution pulse to maintain the particles in random free motion so as to attain the desired properties.

Inventors:
;
Issue Date:
OSTI Identifier:
6320159
Assignee:
TIC; ERA-06-033567; EDB-81-111035
DOE Contract Number:  
W-7405-ENG-48
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; 70 PLASMA PHYSICS AND FUSION TECHNOLOGY; ELECTROPLATING; GLASS; LASER TARGETS; MICROSPHERES; THERMONUCLEAR REACTOR MATERIALS; SURFACE COATING; DEPOSITION; ELECTRODEPOSITION; ELECTROLYSIS; LYSIS; MATERIALS; PLATING; TARGETS; 360601* - Other Materials- Preparation & Manufacture; 700209 - Fusion Power Plant Technology- Component Development & Materials Testing

Citation Formats

Yu, C.M., and Illige, J.D. Apparatus for electroplating particles of small dimension. United States: N. p., 1980. Web.
Yu, C.M., & Illige, J.D. Apparatus for electroplating particles of small dimension. United States.
Yu, C.M., and Illige, J.D. Fri . "Apparatus for electroplating particles of small dimension". United States.
@article{osti_6320159,
title = {Apparatus for electroplating particles of small dimension},
author = {Yu, C.M. and Illige, J.D.},
abstractNote = {The thickness, uniformity, and surface smoothness requirements for surface coatings of glass microspheres for use as targets for laser fusion research are critical. Because of thier minute size, the microspheres are difficult to manipulate and control in electroplating systems. The electroplating apparatus of the present invention addresses these problems by providing a cathode cell having a cell chamber, a cathode and an anode electrically isolated from each other and connected to an electrical power source. During the plating process, the cathode is controllably vibrated along with solution pulse to maintain the particles in random free motion so as to attain the desired properties.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1980},
month = {9}
}