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Title: Double sided circuit board and a method for its manufacture

Abstract

Conductance between the sides of a large double sided printed circuit board is provided using a method which eliminates the need for chemical immersion or photographic exposure of the entire large board. A plurality of through-holes are drilled or punched in a substratum according to the desired pattern, conductive laminae are made to adhere to both sides of the substratum covering the holes and the laminae are pressed together and permanently joined within the holes, providing conductive paths. 4 figs.

Inventors:
Issue Date:
Research Org.:
Universities Research Association, Batavia, IL (USA)
OSTI Identifier:
6286989
Patent Number(s):
-US-A7182671
Application Number:
ON: DE89009601
Assignee:
Dept. of Energy TIC; ERA-14-022848; EDB-89-064090
DOE Contract Number:  
AC02-76CH03000
Resource Type:
Patent
Resource Relation:
Other Information: Portions of this document are illegible in microfiche products
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING; PRINTED CIRCUITS; DESIGN; ELECTRIC CONDUCTORS; EPOXIDES; INVENTIONS; RESINS; ELECTRONIC CIRCUITS; ORGANIC COMPOUNDS; ORGANIC OXYGEN COMPOUNDS; ORGANIC POLYMERS; PETROCHEMICALS; PETROLEUM PRODUCTS; POLYMERS; 420800* - Engineering- Electronic Circuits & Devices- (-1989)

Citation Formats

Lindenmeyer, C.W. Double sided circuit board and a method for its manufacture. United States: N. p., 1988. Web.
Lindenmeyer, C.W. Double sided circuit board and a method for its manufacture. United States.
Lindenmeyer, C.W. Thu . "Double sided circuit board and a method for its manufacture". United States.
@article{osti_6286989,
title = {Double sided circuit board and a method for its manufacture},
author = {Lindenmeyer, C.W.},
abstractNote = {Conductance between the sides of a large double sided printed circuit board is provided using a method which eliminates the need for chemical immersion or photographic exposure of the entire large board. A plurality of through-holes are drilled or punched in a substratum according to the desired pattern, conductive laminae are made to adhere to both sides of the substratum covering the holes and the laminae are pressed together and permanently joined within the holes, providing conductive paths. 4 figs.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1988},
month = {4}
}