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Title: Three dimensional, multi-chip module

Abstract

A plurality of multi-chip modules are stacked and bonded around the perimeter by sold-bump bonds to adjacent modules on, for instance, three sides of the perimeter. The fourth side can be used for coolant distribution, for more interconnect structures, or other features, depending on particular design considerations of the chip set. The multi-chip modules comprise a circuit board, having a planarized interconnect structure formed on a first major surface, and integrated circuit chips bonded to the planarized interconnect surface. Around the periphery of each circuit board, long, narrow dummy chips'' are bonded to the finished circuit board to form a perimeter wall. The wall is higher than any of the chips on the circuit board, so that the flat back surface of the board above will only touch the perimeter wall. Module-to-module interconnect is laser-patterned on the sides of the boards and over the perimeter wall in the same way and at the same time that chip to board interconnect may be laser-patterned.

Inventors:
;
Issue Date:
OSTI Identifier:
6229718
Patent Number(s):
5241450 A
Application Number:
PPN: US 7-850642
Assignee:
Dept. of Energy, Washington, DC (United States)
DOE Contract Number:  
W-7405-ENG-48
Resource Type:
Patent
Resource Relation:
Patent File Date: 13 Mar 1992
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING; MICROELECTRONIC CIRCUITS; DESIGN; BONDING; COOLANTS; ETCHING; INTEGRATED CIRCUITS; LAYERS; ELECTRONIC CIRCUITS; FABRICATION; JOINING; SURFACE FINISHING; 426000* - Engineering- Components, Electron Devices & Circuits- (1990-)

Citation Formats

Bernhardt, A F, and Petersen, R W. Three dimensional, multi-chip module. United States: N. p., 1993. Web.
Bernhardt, A F, & Petersen, R W. Three dimensional, multi-chip module. United States.
Bernhardt, A F, and Petersen, R W. Tue . "Three dimensional, multi-chip module". United States.
@article{osti_6229718,
title = {Three dimensional, multi-chip module},
author = {Bernhardt, A F and Petersen, R W},
abstractNote = {A plurality of multi-chip modules are stacked and bonded around the perimeter by sold-bump bonds to adjacent modules on, for instance, three sides of the perimeter. The fourth side can be used for coolant distribution, for more interconnect structures, or other features, depending on particular design considerations of the chip set. The multi-chip modules comprise a circuit board, having a planarized interconnect structure formed on a first major surface, and integrated circuit chips bonded to the planarized interconnect surface. Around the periphery of each circuit board, long, narrow dummy chips'' are bonded to the finished circuit board to form a perimeter wall. The wall is higher than any of the chips on the circuit board, so that the flat back surface of the board above will only touch the perimeter wall. Module-to-module interconnect is laser-patterned on the sides of the boards and over the perimeter wall in the same way and at the same time that chip to board interconnect may be laser-patterned.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1993},
month = {8}
}