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Title: Direct write with microelectronic circuit fabrication

Abstract

In a process for deposition of material onto a substrate, for example, the deposition of metals for dielectrics onto a semiconductor laser, the material is deposited by providing a colloidal suspension of the material and directly writing the suspension onto the substrate surface by ink jet printing techniques. This procedure minimizes the handling requirements of the substrate during the deposition process and also minimizes the exchange of energy between the material to be deposited and the substrate at the interface. The deposited material is then resolved into a desired pattern, preferably by subjecting the deposit to a laser annealing step. The laser annealing step provides high resolution of the resultant pattern while minimizing the overall thermal load of the substrate and permitting precise control of interface chemistry and interdiffusion between the substrate and the deposit. 3 figs.

Inventors:
;
Issue Date:
Research Org.:
Sandia National Labs., Albuquerque, NM (USA)
OSTI Identifier:
6157870
Patent Number(s):
-US-A7200096
Application Number:
ON: DE89009660
Assignee:
Dept. of Energy SNL; EDB-89-064087
DOE Contract Number:  
AC04-76DP00789
Resource Type:
Patent
Resource Relation:
Other Information: Portions of this document are illegible in microfiche products
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING; 36 MATERIALS SCIENCE; MICROELECTRONIC CIRCUITS; FABRICATION; DEPOSITION; DESIGN; INVENTIONS; MICROELECTRONICS; SUBSTRATES; ELECTRONIC CIRCUITS; 420800* - Engineering- Electronic Circuits & Devices- (-1989); 360601 - Other Materials- Preparation & Manufacture

Citation Formats

Drummond, T., and Ginley, D. Direct write with microelectronic circuit fabrication. United States: N. p., 1988. Web.
Drummond, T., & Ginley, D. Direct write with microelectronic circuit fabrication. United States.
Drummond, T., and Ginley, D. Tue . "Direct write with microelectronic circuit fabrication". United States.
@article{osti_6157870,
title = {Direct write with microelectronic circuit fabrication},
author = {Drummond, T. and Ginley, D.},
abstractNote = {In a process for deposition of material onto a substrate, for example, the deposition of metals for dielectrics onto a semiconductor laser, the material is deposited by providing a colloidal suspension of the material and directly writing the suspension onto the substrate surface by ink jet printing techniques. This procedure minimizes the handling requirements of the substrate during the deposition process and also minimizes the exchange of energy between the material to be deposited and the substrate at the interface. The deposited material is then resolved into a desired pattern, preferably by subjecting the deposit to a laser annealing step. The laser annealing step provides high resolution of the resultant pattern while minimizing the overall thermal load of the substrate and permitting precise control of interface chemistry and interdiffusion between the substrate and the deposit. 3 figs.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1988},
month = {5}
}