Microchannel cooling of face down bonded chips
Abstract
Microchannel cooling is applied to flip-chip bonded integrated circuits, in a manner which maintains the advantages of flip-chip bonds, while overcoming the difficulties encountered in cooling the chips. The technique is suited to either multi chip integrated circuit boards in a plane, or to stacks of circuit boards in a three dimensional interconnect structure. Integrated circuit chips are mounted on a circuit board using flip-chip or control collapse bonds. A microchannel structure is essentially permanently coupled with the back of the chip. A coolant delivery manifold delivers coolant to the microchannel structure, and a seal consisting of a compressible elastomer is provided between the coolant delivery manifold and the microchannel structure. The integrated circuit chip and microchannel structure are connected together to form a replaceable integrated circuit module which can be easily decoupled from the coolant delivery manifold and the circuit board. The coolant supply manifolds may be disposed between the circuit boards in a stack and coupled to supplies of coolant through a side of the stack.
- Inventors:
- Issue Date:
- OSTI Identifier:
- 6047920
- Patent Number(s):
- 5218515
- Application Number:
- PPN: US 7-850634
- Assignee:
- Dept. of Energy, Washington, DC (United States)
- DOE Contract Number:
- W-7405-ENG-48
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 13 Mar 1992
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATION; INTEGRATED CIRCUITS; COOLING; COOLANTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; ELECTRONIC CIRCUITS; MICROELECTRONIC CIRCUITS; 320303* - Energy Conservation, Consumption, & Utilization- Industrial & Agricultural Processes- Equipment & Processes
Citation Formats
Bernhardt, A F. Microchannel cooling of face down bonded chips. United States: N. p., 1993.
Web.
Bernhardt, A F. Microchannel cooling of face down bonded chips. United States.
Bernhardt, A F. Tue .
"Microchannel cooling of face down bonded chips". United States.
@article{osti_6047920,
title = {Microchannel cooling of face down bonded chips},
author = {Bernhardt, A F},
abstractNote = {Microchannel cooling is applied to flip-chip bonded integrated circuits, in a manner which maintains the advantages of flip-chip bonds, while overcoming the difficulties encountered in cooling the chips. The technique is suited to either multi chip integrated circuit boards in a plane, or to stacks of circuit boards in a three dimensional interconnect structure. Integrated circuit chips are mounted on a circuit board using flip-chip or control collapse bonds. A microchannel structure is essentially permanently coupled with the back of the chip. A coolant delivery manifold delivers coolant to the microchannel structure, and a seal consisting of a compressible elastomer is provided between the coolant delivery manifold and the microchannel structure. The integrated circuit chip and microchannel structure are connected together to form a replaceable integrated circuit module which can be easily decoupled from the coolant delivery manifold and the circuit board. The coolant supply manifolds may be disposed between the circuit boards in a stack and coupled to supplies of coolant through a side of the stack.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1993},
month = {6}
}