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Title: Microchannel cooling of face down bonded chips

Abstract

Microchannel cooling is applied to flip-chip bonded integrated circuits, in a manner which maintains the advantages of flip-chip bonds, while overcoming the difficulties encountered in cooling the chips. The technique is suited to either multi chip integrated circuit boards in a plane, or to stacks of circuit boards in a three dimensional interconnect structure. Integrated circuit chips are mounted on a circuit board using flip-chip or control collapse bonds. A microchannel structure is essentially permanently coupled with the back of the chip. A coolant delivery manifold delivers coolant to the microchannel structure, and a seal consisting of a compressible elastomer is provided between the coolant delivery manifold and the microchannel structure. The integrated circuit chip and microchannel structure are connected together to form a replaceable integrated circuit module which can be easily decoupled from the coolant delivery manifold and the circuit board. The coolant supply manifolds may be disposed between the circuit boards in a stack and coupled to supplies of coolant through a side of the stack.

Inventors:
Issue Date:
OSTI Identifier:
6047920
Patent Number(s):
5218515 A
Application Number:
PPN: US 7-850634
Assignee:
Dept. of Energy, Washington, DC (United States)
DOE Contract Number:  
W-7405-ENG-48
Resource Type:
Patent
Resource Relation:
Patent File Date: 13 Mar 1992
Country of Publication:
United States
Language:
English
Subject:
32 ENERGY CONSERVATION, CONSUMPTION, AND UTILIZATION; INTEGRATED CIRCUITS; COOLING; COOLANTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES; ELECTRONIC CIRCUITS; MICROELECTRONIC CIRCUITS; 320303* - Energy Conservation, Consumption, & Utilization- Industrial & Agricultural Processes- Equipment & Processes

Citation Formats

Bernhardt, A F. Microchannel cooling of face down bonded chips. United States: N. p., 1993. Web.
Bernhardt, A F. Microchannel cooling of face down bonded chips. United States.
Bernhardt, A F. Tue . "Microchannel cooling of face down bonded chips". United States.
@article{osti_6047920,
title = {Microchannel cooling of face down bonded chips},
author = {Bernhardt, A F},
abstractNote = {Microchannel cooling is applied to flip-chip bonded integrated circuits, in a manner which maintains the advantages of flip-chip bonds, while overcoming the difficulties encountered in cooling the chips. The technique is suited to either multi chip integrated circuit boards in a plane, or to stacks of circuit boards in a three dimensional interconnect structure. Integrated circuit chips are mounted on a circuit board using flip-chip or control collapse bonds. A microchannel structure is essentially permanently coupled with the back of the chip. A coolant delivery manifold delivers coolant to the microchannel structure, and a seal consisting of a compressible elastomer is provided between the coolant delivery manifold and the microchannel structure. The integrated circuit chip and microchannel structure are connected together to form a replaceable integrated circuit module which can be easily decoupled from the coolant delivery manifold and the circuit board. The coolant supply manifolds may be disposed between the circuit boards in a stack and coupled to supplies of coolant through a side of the stack.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1993},
month = {6}
}