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Title: Electrically conductive resinous bond and method of manufacture

Abstract

A method of bonding elements together with a bond of high strength and good electrical conductivity which comprises: applying an unfilled polyimide resin between surfaces of the elements to be bonded, heat treating said unfilled polyimide resin in stages between a temperature range of about 40 to 365/sup 0/C to form a strong adhesive bond between said elements, applying a metal-filled polyimide resin overcoat between said elements so as to provide electrical connection therebetween, and heat treating said metal-filled polyimide resin with substantially the same temperature profile as the unfilled polyimide resin. The present invention is also concerned with an adhesive, resilient, substantially void free bonding combination for providing a high strength, electrically conductive adhesive attachment between electrically conductive elements which comprises a major amount of an unfilled polyimide resin and a minor amount of a metal-filled polyimide resin.

Inventors:
;
Issue Date:
Research Org.:
General Electric Co., St. Petersburg, FL (USA)
OSTI Identifier:
5656731
Application Number:
ON: DE86013793
Assignee:
Dept. of Energy TIC; ERA-11-005320; EDB-86-137586
DOE Contract Number:  
AC04-76DP00656
Resource Type:
Patent
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING; QUARTZ; BONDING; RESONATORS; FABRICATION; ADHESIVES; HEAT TREATMENTS; RESINS; CHALCOGENIDES; ELECTRONIC EQUIPMENT; EQUIPMENT; JOINING; MINERALS; ORGANIC COMPOUNDS; ORGANIC POLYMERS; OXIDE MINERALS; OXIDES; OXYGEN COMPOUNDS; PETROCHEMICALS; PETROLEUM PRODUCTS; POLYMERS; SILICON COMPOUNDS; SILICON OXIDES; 420800* - Engineering- Electronic Circuits & Devices- (-1989)

Citation Formats

Snowden, T.M. Jr., and Wells, B.J. Electrically conductive resinous bond and method of manufacture. United States: N. p., 1985. Web.
Snowden, T.M. Jr., & Wells, B.J. Electrically conductive resinous bond and method of manufacture. United States.
Snowden, T.M. Jr., and Wells, B.J. Tue . "Electrically conductive resinous bond and method of manufacture". United States.
@article{osti_5656731,
title = {Electrically conductive resinous bond and method of manufacture},
author = {Snowden, T.M. Jr. and Wells, B.J.},
abstractNote = {A method of bonding elements together with a bond of high strength and good electrical conductivity which comprises: applying an unfilled polyimide resin between surfaces of the elements to be bonded, heat treating said unfilled polyimide resin in stages between a temperature range of about 40 to 365/sup 0/C to form a strong adhesive bond between said elements, applying a metal-filled polyimide resin overcoat between said elements so as to provide electrical connection therebetween, and heat treating said metal-filled polyimide resin with substantially the same temperature profile as the unfilled polyimide resin. The present invention is also concerned with an adhesive, resilient, substantially void free bonding combination for providing a high strength, electrically conductive adhesive attachment between electrically conductive elements which comprises a major amount of an unfilled polyimide resin and a minor amount of a metal-filled polyimide resin.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1985},
month = {1}
}