High adherence copper plating process
Abstract
A process is described for applying copper to a substrate of aluminum or steel by electrodeposition and for preparing the surface of an aluminum or steel substrate for the electrodeposition of copper. Practice of the invention provides good adhesion of the copper layer to either substrate.
- Inventors:
- Issue Date:
- OSTI Identifier:
- 5448943
- Patent Number(s):
- 5246565
- Application Number:
- PPN: US 7-881025
- Assignee:
- Dept. of Energy, Washington, DC (United States)
- DOE Contract Number:
- W-7405-ENG-36
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 7 May 1992
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE; ALUMINIUM; ELECTRODEPOSITED COATINGS; SURFACE CLEANING; COPPER; ELECTRODEPOSITION; STEELS; ALLOYS; CLEANING; COATINGS; DEPOSITION; ELECTROLYSIS; ELEMENTS; IRON ALLOYS; IRON BASE ALLOYS; LYSIS; METALS; SURFACE COATING; SURFACE FINISHING; TRANSITION ELEMENTS; 360101* - Metals & Alloys- Preparation & Fabrication
Citation Formats
Nignardot, H. High adherence copper plating process. United States: N. p., 1993.
Web.
Nignardot, H. High adherence copper plating process. United States.
Nignardot, H. Tue .
"High adherence copper plating process". United States.
@article{osti_5448943,
title = {High adherence copper plating process},
author = {Nignardot, H},
abstractNote = {A process is described for applying copper to a substrate of aluminum or steel by electrodeposition and for preparing the surface of an aluminum or steel substrate for the electrodeposition of copper. Practice of the invention provides good adhesion of the copper layer to either substrate.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1993},
month = {9}
}
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