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Title: High adherence copper plating process

Abstract

A process is described for applying copper to a substrate of aluminum or steel by electrodeposition and for preparing the surface of an aluminum or steel substrate for the electrodeposition of copper. Practice of the invention provides good adhesion of the copper layer to either substrate.

Inventors:
Issue Date:
OSTI Identifier:
5448943
Patent Number(s):
5246565
Application Number:
PPN: US 7-881025
Assignee:
Dept. of Energy, Washington, DC (United States)
DOE Contract Number:  
W-7405-ENG-36
Resource Type:
Patent
Resource Relation:
Patent File Date: 7 May 1992
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; ALUMINIUM; ELECTRODEPOSITED COATINGS; SURFACE CLEANING; COPPER; ELECTRODEPOSITION; STEELS; ALLOYS; CLEANING; COATINGS; DEPOSITION; ELECTROLYSIS; ELEMENTS; IRON ALLOYS; IRON BASE ALLOYS; LYSIS; METALS; SURFACE COATING; SURFACE FINISHING; TRANSITION ELEMENTS; 360101* - Metals & Alloys- Preparation & Fabrication

Citation Formats

Nignardot, H. High adherence copper plating process. United States: N. p., 1993. Web.
Nignardot, H. High adherence copper plating process. United States.
Nignardot, H. Tue . "High adherence copper plating process". United States.
@article{osti_5448943,
title = {High adherence copper plating process},
author = {Nignardot, H},
abstractNote = {A process is described for applying copper to a substrate of aluminum or steel by electrodeposition and for preparing the surface of an aluminum or steel substrate for the electrodeposition of copper. Practice of the invention provides good adhesion of the copper layer to either substrate.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1993},
month = {9}
}