Apparatus for sectioning demountable semiconductor samples
Abstract
Apparatus for use during polishing and sectioning operations of a ribbon sample is described. The sample holder includes a cylinder having an axially extending sample cavity terminated in a first funnel-shaped opening and a second slot-like opening. A spring-loaded pressure plunger is located adjacent the second opening of the sample cavity for frictional engagement of the sample cavity. A heat softenable molding medium is inserted in the funnel-shaped opening, to surround the sample. After polishing, the heater is energized to allow draining of the molding medium from the sample cavity. During manual polishing, the second end of the sample holder is inserted in a support ring which provides mechanical support as well as alignment of the sample holder during polishing. A gauge block for measuring the protrusion of a sample beyond the second wall of the holder is also disclosed.
- Inventors:
- Issue Date:
- OSTI Identifier:
- 5383221
- Application Number:
- ON: DE84006185
- Assignee:
- EDB-84-036727
- DOE Contract Number:
- AC02-77CH00178
- Resource Type:
- Patent
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE; 14 SOLAR ENERGY; SAMPLE HOLDERS; DESIGN; SEMICONDUCTOR MATERIALS; CUTTING; POLISHING; MACHINING; MATERIALS; SURFACE FINISHING; 360601* - Other Materials- Preparation & Manufacture; 140501 - Solar Energy Conversion- Photovoltaic Conversion
Citation Formats
Sopori, B L, and Wolf, A. Apparatus for sectioning demountable semiconductor samples. United States: N. p., 1984.
Web.
Sopori, B L, & Wolf, A. Apparatus for sectioning demountable semiconductor samples. United States.
Sopori, B L, and Wolf, A. Sun .
"Apparatus for sectioning demountable semiconductor samples". United States.
@article{osti_5383221,
title = {Apparatus for sectioning demountable semiconductor samples},
author = {Sopori, B L and Wolf, A},
abstractNote = {Apparatus for use during polishing and sectioning operations of a ribbon sample is described. The sample holder includes a cylinder having an axially extending sample cavity terminated in a first funnel-shaped opening and a second slot-like opening. A spring-loaded pressure plunger is located adjacent the second opening of the sample cavity for frictional engagement of the sample cavity. A heat softenable molding medium is inserted in the funnel-shaped opening, to surround the sample. After polishing, the heater is energized to allow draining of the molding medium from the sample cavity. During manual polishing, the second end of the sample holder is inserted in a support ring which provides mechanical support as well as alignment of the sample holder during polishing. A gauge block for measuring the protrusion of a sample beyond the second wall of the holder is also disclosed.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Sun Jan 01 00:00:00 EST 1984},
month = {Sun Jan 01 00:00:00 EST 1984}
}