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Title: Method for producing high quality oxide films on substrates

Abstract

A method is described for providing an oxide film of a material on the surface of a substrate using a reactive deposition of the material onto the substrate surface in the presence of a solid or liquid layer of an oxidizing gas. The oxidizing gas is provided on the substrate surface in an amount sufficient to dissipate the latent heat of condensation occurring during deposition as well as creating a favorable oxidizing environment for the material. 4 figures.

Inventors:
; ;
Issue Date:
OSTI Identifier:
5364578
Patent Number(s):
5264394
Application Number:
PPN: US 7-704097
Assignee:
Associated Universities, Inc., Washington, DC (United States)
DOE Contract Number:  
AC02-76CH00016
Resource Type:
Patent
Resource Relation:
Patent File Date: 22 May 1991
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; OXIDES; CHEMICAL VAPOR DEPOSITION; COMPOSITE MATERIALS; FABRICATION; FORMATION HEAT; OXIDIZERS; THIN FILMS; CHALCOGENIDES; CHEMICAL COATING; DEPOSITION; ENTHALPY; FILMS; MATERIALS; OXYGEN COMPOUNDS; PHYSICAL PROPERTIES; REACTION HEAT; SURFACE COATING; THERMODYNAMIC PROPERTIES; 360201* - Ceramics, Cermets, & Refractories- Preparation & Fabrication

Citation Formats

Ruckman, M W, Strongin, M, and Gao, Y L. Method for producing high quality oxide films on substrates. United States: N. p., 1993. Web.
Ruckman, M W, Strongin, M, & Gao, Y L. Method for producing high quality oxide films on substrates. United States.
Ruckman, M W, Strongin, M, and Gao, Y L. Tue . "Method for producing high quality oxide films on substrates". United States.
@article{osti_5364578,
title = {Method for producing high quality oxide films on substrates},
author = {Ruckman, M W and Strongin, M and Gao, Y L},
abstractNote = {A method is described for providing an oxide film of a material on the surface of a substrate using a reactive deposition of the material onto the substrate surface in the presence of a solid or liquid layer of an oxidizing gas. The oxidizing gas is provided on the substrate surface in an amount sufficient to dissipate the latent heat of condensation occurring during deposition as well as creating a favorable oxidizing environment for the material. 4 figures.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1993},
month = {11}
}