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Title: Dual manifold heat pipe evaporator

Abstract

An improved evaporator section is described for a dual manifold heat pipe. Both the upper and lower manifolds can have surfaces exposed to the heat source which evaporate the working fluid. The tubes in the tube bank between the manifolds have openings in their lower extensions into the lower manifold to provide for the transport of evaporated working fluid from the lower manifold into the tubes and from there on into the upper manifold and on to the condenser portion of the heat pipe. A wick structure lining the inner walls of the evaporator tubes extends into both the upper and lower manifolds. At least some of the tubes also have overflow tubes contained within them to carry condensed working fluid from the upper manifold to pass to the lower without spilling down the inside walls of the tubes. 1 figure.

Inventors:
;
Issue Date:
OSTI Identifier:
5221825
Patent Number(s):
5275232
Application Number:
PPN: US 8-031514
Assignee:
Sandia National Labs., Albuquerque, NM ()
DOE Contract Number:  
AC04-76DP00789
Resource Type:
Patent
Resource Relation:
Patent File Date: 15 Mar 1993
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING; EVAPORATORS; DESIGN; HEAT PIPES; EVAPORATION; OPERATION; WORKING FLUIDS; FLUIDS; PHASE TRANSFORMATIONS; 420400* - Engineering- Heat Transfer & Fluid Flow

Citation Formats

Adkins, D R, and Rawlinson, K S. Dual manifold heat pipe evaporator. United States: N. p., 1994. Web.
Adkins, D R, & Rawlinson, K S. Dual manifold heat pipe evaporator. United States.
Adkins, D R, and Rawlinson, K S. Tue . "Dual manifold heat pipe evaporator". United States.
@article{osti_5221825,
title = {Dual manifold heat pipe evaporator},
author = {Adkins, D R and Rawlinson, K S},
abstractNote = {An improved evaporator section is described for a dual manifold heat pipe. Both the upper and lower manifolds can have surfaces exposed to the heat source which evaporate the working fluid. The tubes in the tube bank between the manifolds have openings in their lower extensions into the lower manifold to provide for the transport of evaporated working fluid from the lower manifold into the tubes and from there on into the upper manifold and on to the condenser portion of the heat pipe. A wick structure lining the inner walls of the evaporator tubes extends into both the upper and lower manifolds. At least some of the tubes also have overflow tubes contained within them to carry condensed working fluid from the upper manifold to pass to the lower without spilling down the inside walls of the tubes. 1 figure.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1994},
month = {1}
}

Patent:
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