Magnetically attached sputter targets

Title: Magnetically attached sputter targets

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Abstract

An improved method and assembly for attaching sputtering targets to cathode assemblies of sputtering systems which includes a magnetically permeable material is described. The magnetically permeable material is imbedded in a target base that is brazed, welded, or soldered to the sputter target, or is mechanically retained in the target material. Target attachment to the cathode is achieved by virtue of the permanent magnets and/or the pole pieces in the cathode assembly that create magnetic flux lines adjacent to the backing plate, which strongly attract the magnetically permeable material in the target assembly. 11 figures.

Inventors:: Makowiecki, D M; McKernan, M A

Issue Date:: 1994-02-15

OSTI Identifier:: 5213946

Patent Number(s):: 5286361

Application Number:: PPN: US 7-962657

Assignee:: Univ. of California, Oakland, CA ()

DOE Contract Number:: W-7405-ENG-48

Resource Type:: Patent

Resource Relation:: Patent File Date: 19 Oct 1992

Country of Publication:: United States

Language:: English

Subject:: 71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS; Ta; CATHODE SPUTTERING; TARGETS; DESIGN; MAGNETIC FLUX; MAGNETIC MATERIALS; MATERIALS; SPUTTERING; 661220* - Particle Beam Production & Handling; Targets- (1992-)

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                    Makowiecki, D M, and McKernan, M A. Magnetically attached sputter targets.  United States: N. p., 1994. 
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                    Makowiecki, D M, & McKernan, M A. Magnetically attached sputter targets.  United States.

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                    Makowiecki, D M, and McKernan, M A. Tue .  
        "Magnetically attached sputter targets".  United States.

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@article{osti_5213946,

  title        = {Magnetically attached sputter targets},

  author       = {Makowiecki, D M and McKernan, M A},

  abstractNote = {An improved method and assembly for attaching sputtering targets to cathode assemblies of sputtering systems which includes a magnetically permeable material is described. The magnetically permeable material is imbedded in a target base that is brazed, welded, or soldered to the sputter target, or is mechanically retained in the target material. Target attachment to the cathode is achieved by virtue of the permanent magnets and/or the pole pieces in the cathode assembly that create magnetic flux lines adjacent to the backing plate, which strongly attract the magnetically permeable material in the target assembly. 11 figures.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {1994},

  month        = {2}

}

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