Magnetically attached sputter targets
Abstract
An improved method and assembly for attaching sputtering targets to cathode assemblies of sputtering systems which includes a magnetically permeable material is described. The magnetically permeable material is imbedded in a target base that is brazed, welded, or soldered to the sputter target, or is mechanically retained in the target material. Target attachment to the cathode is achieved by virtue of the permanent magnets and/or the pole pieces in the cathode assembly that create magnetic flux lines adjacent to the backing plate, which strongly attract the magnetically permeable material in the target assembly. 11 figures.
- Inventors:
- Issue Date:
- OSTI Identifier:
- 5213946
- Patent Number(s):
- 5286361
- Application Number:
- PPN: US 7-962657
- Assignee:
- Univ. of California, Oakland, CA ()
- DOE Contract Number:
- W-7405-ENG-48
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 19 Oct 1992
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 71 CLASSICAL AND QUANTUM MECHANICS, GENERAL PHYSICS; Ta; CATHODE SPUTTERING; TARGETS; DESIGN; MAGNETIC FLUX; MAGNETIC MATERIALS; MATERIALS; SPUTTERING; 661220* - Particle Beam Production & Handling; Targets- (1992-)
Citation Formats
Makowiecki, D M, and McKernan, M A. Magnetically attached sputter targets. United States: N. p., 1994.
Web.
Makowiecki, D M, & McKernan, M A. Magnetically attached sputter targets. United States.
Makowiecki, D M, and McKernan, M A. Tue .
"Magnetically attached sputter targets". United States.
@article{osti_5213946,
title = {Magnetically attached sputter targets},
author = {Makowiecki, D M and McKernan, M A},
abstractNote = {An improved method and assembly for attaching sputtering targets to cathode assemblies of sputtering systems which includes a magnetically permeable material is described. The magnetically permeable material is imbedded in a target base that is brazed, welded, or soldered to the sputter target, or is mechanically retained in the target material. Target attachment to the cathode is achieved by virtue of the permanent magnets and/or the pole pieces in the cathode assembly that create magnetic flux lines adjacent to the backing plate, which strongly attract the magnetically permeable material in the target assembly. 11 figures.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1994},
month = {2}
}