Use of 2,5-dimethyl-2,5-hexane diamine as a curing agent for epoxy resins. [Patent application]

Title: Use of 2,5-dimethyl-2,5-hexane diamine as a curing agent for epoxy resins. [Patent application]

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Abstract

Primary diamines are prepared for use as a curing agent for epoxy resins. These curing agents can be used to form epoxy resin mixtures useful in filament winding and preimpregnated fiber molding and in formulating film adhesives, powder coatings and molding powders. The epoxy mixtures form for such uses a room temperature non-reacting, intermediate stable state which has a latent cross-linking capability.

Inventors:: Rinde, J.A.; Newey, H.A.

OSTI Identifier:: 5102437

Assignee:: Dept. of Energy TIC; ERA-05-038456; EDB-80-118146

DOE Contract Number:: W-7405-ENG-48

Resource Type:: Patent

Country of Publication:: United States

Language:: English

Subject:: 37 INORGANIC, ORGANIC, PHYSICAL AND ANALYTICAL CHEMISTRY; EPOXIDES; CURING; RESINS; AMINES; ORGANIC COMPOUNDS; ORGANIC OXYGEN COMPOUNDS; ORGANIC POLYMERS; PETROCHEMICALS; PETROLEUM PRODUCTS; POLYMERS; 400301* - Organic Chemistry- Chemical & Physicochemical Properties- (-1987)

Citation Formats


                    Rinde, J.A., and Newey, H.A. Use of 2,5-dimethyl-2,5-hexane diamine as a curing agent for epoxy resins. [Patent application].  United States: N. p.,  
        Web.

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                    Rinde, J.A., & Newey, H.A. Use of 2,5-dimethyl-2,5-hexane diamine as a curing agent for epoxy resins. [Patent application].  United States.

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                    Rinde, J.A., and Newey, H.A. .  
        "Use of 2,5-dimethyl-2,5-hexane diamine as a curing agent for epoxy resins. [Patent application]".  United States.

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@article{osti_5102437,

  title        = {Use of 2,5-dimethyl-2,5-hexane diamine as a curing agent for epoxy resins. [Patent application]},

  author       = {Rinde, J.A. and Newey, H.A.},

  abstractNote = {Primary diamines are prepared for use as a curing agent for epoxy resins. These curing agents can be used to form epoxy resin mixtures useful in filament winding and preimpregnated fiber molding and in formulating film adhesives, powder coatings and molding powders. The epoxy mixtures form for such uses a room temperature non-reacting, intermediate stable state which has a latent cross-linking capability.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {},

  month        = {}

}

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Use of 2,5-dimethyl-2,5-hexane diamine as a curing agent for epoxy resins

Patent Rinde, J.A.; Newey, H.A.

Primary diamines are disclosed of the formula shown in a diagram wherein R is a straight chain saturated hydrocarbon of 2 to 4 carbons, a disubstituted benzene ring, or disubstituted dibenzomethane for use as a curing agent for epoxy resins. These curing agents can be used to form epoxy resin mixtures useful in filament winding and pre-impregnated fiber molding and in formulating film adhesives, powder coatings and molding powders. The epoxy mixtures form for such uses as room temperature non-reacting, intermediate stable state which has a latent cross-linking capability.
Use of 2,5-dimethyl-2,5-hexane diamine as a curing agent for epoxy resins

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Primary diamines of the formula ##STR1## wherein R is a straight chain saturated hydrocarbon of 2 to 4 carbons, a disubstituted benzene ring, or disubstituted dibenzo methane for use as a curing agent for epoxy resins. These curing agents can be used to form epoxy resin mixtures useful in filament winding and pre-impregnated fiber molding and in formulating film adhesives, powder coatings and molding powders. The epoxy mixtures form for such uses as room temperature non-reacting, intermediate stable state which has a latent cross-linking capability.
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A new curing agent for epoxy resins that has both interesting and useful properties was found. The compound, 2,5 dimethyl 2,5 hexane diamine (DMHDA) is a sterically hindered primary aliphatic amine that, as a curing agent for DGEBA epoxy resins, has the following desirable characteristics: at room temperature it forms a stable B-stage resin; it is a good wet-filament winding resin having a low viscosity (0.5 Pa.s) and a long gel time (21 h for a 30-g mass); the cured resin properties are good, for example, the tensile strength is 86 MPa (12,500 psi), and the glass transition temperature ismore »« less
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We have discovered a new curing agent for epoxy resins that has both interesting and useful properties. The compound, 2,5 dimethyl 2,5 hexane diamine (DMHDA) is a sterically hindered primary aliphatic amine that, as a curing agent for DGEBA epoxy resins, has the following desirable characteristics: (a) at room temperature it forms a stable B-stage resin; (b) it is a good wet-filament winding resin having a low viscosity (0.5 Pa.s) and a long gel time (21 h for a 30-g mass); (c) the cured resin properties are good - for example, the tensile strength is 86 MPa (12,500 psi), andmore »« less
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