Use of 2,5-dimethyl-2,5-hexane diamine as a curing agent for epoxy resins. [Patent application]

Title: Use of 2,5-dimethyl-2,5-hexane diamine as a curing agent for epoxy resins. [Patent application]

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Abstract

Primary diamines are prepared for use as a curing agent for epoxy resins. These curing agents can be used to form epoxy resin mixtures useful in filament winding and preimpregnated fiber molding and in formulating film adhesives, powder coatings and molding powders. The epoxy mixtures form for such uses a room temperature non-reacting, intermediate stable state which has a latent cross-linking capability.

Inventors:: Rinde, J A; Newey, H A

OSTI Identifier:: 5102437

Assignee:: Dept. of Energy

DOE Contract Number:: W-7405-ENG-48

Resource Type:: Patent

Country of Publication:: United States

Language:: English

Subject:: 37 INORGANIC, ORGANIC, PHYSICAL AND ANALYTICAL CHEMISTRY; EPOXIDES; CURING; RESINS; AMINES; ORGANIC COMPOUNDS; ORGANIC OXYGEN COMPOUNDS; ORGANIC POLYMERS; PETROCHEMICALS; PETROLEUM PRODUCTS; POLYMERS; 400301* - Organic Chemistry- Chemical & Physicochemical Properties- (-1987)

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                    Rinde, J A, and Newey, H A. Use of 2,5-dimethyl-2,5-hexane diamine as a curing agent for epoxy resins. [Patent application].  United States: N. p.,  
        Web.

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                    Rinde, J A, & Newey, H A. Use of 2,5-dimethyl-2,5-hexane diamine as a curing agent for epoxy resins. [Patent application].  United States.

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                    Rinde, J A, and Newey, H A. .  
        "Use of 2,5-dimethyl-2,5-hexane diamine as a curing agent for epoxy resins. [Patent application]".  United States.

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@article{osti_5102437,

  title        = {Use of 2,5-dimethyl-2,5-hexane diamine as a curing agent for epoxy resins. [Patent application]},

  author       = {Rinde, J A and Newey, H A},

  abstractNote = {Primary diamines are prepared for use as a curing agent for epoxy resins. These curing agents can be used to form epoxy resin mixtures useful in filament winding and preimpregnated fiber molding and in formulating film adhesives, powder coatings and molding powders. The epoxy mixtures form for such uses a room temperature non-reacting, intermediate stable state which has a latent cross-linking capability.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {},

  month        = {}

}

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Use of 2,5-dimethyl-2,5-hexane diamine as a curing agent for epoxy resins

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Primary diamines are disclosed of the formula shown in a diagram wherein R is a straight chain saturated hydrocarbon of 2 to 4 carbons, a disubstituted benzene ring, or disubstituted dibenzomethane for use as a curing agent for epoxy resins. These curing agents can be used to form epoxy resin mixtures useful in filament winding and pre-impregnated fiber molding and in formulating film adhesives, powder coatings and molding powders. The epoxy mixtures form for such uses as room temperature non-reacting, intermediate stable state which has a latent cross-linking capability.
Use of 2,5-dimethyl-2,5-hexane diamine as a curing agent for epoxy resins

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Primary diamines of the formula ##STR1## wherein R is a straight chain saturated hydrocarbon of 2 to 4 carbons, a disubstituted benzene ring, or disubstituted dibenzo methane for use as a curing agent for epoxy resins. These curing agents can be used to form epoxy resin mixtures useful in filament winding and pre-impregnated fiber molding and in formulating film adhesives, powder coatings and molding powders. The epoxy mixtures form for such uses as room temperature non-reacting, intermediate stable state which has a latent cross-linking capability.
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