skip to main content
DOE Patents title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Pressure activated diaphragm bonder

Abstract

A device is available for bonding one component to another, particularly for bonding electronic components of integrated circuits, such as chips, to a substrate. The bonder device in one embodiment includes a bottom metal block having a machined opening wherein a substrate is located, a template having machined openings which match solder patterns on the substrate, a thin diaphragm placed over the template after the chips have been positioned in the openings therein, and a top metal block positioned over the diaphragm and secured to the bottom block, with the diaphragm retained therebetween. The top block includes a countersink portion which extends over at least the area of the template and an opening through which a high pressure inert gas is supplied to exert uniform pressure distribution over the diaphragm to keep the chips in place during soldering. A heating means is provided to melt the solder patterns on the substrate and thereby solder the chips thereto. 4 figs.

Inventors:
;
Issue Date:
Research Org.:
University of California
Sponsoring Org.:
USDOE, Washington, DC (United States)
OSTI Identifier:
489104
Patent Number(s):
5,632,434
Application Number:
PAN: 8-496,587
Assignee:
Univ. of California, Oakland, CA (United States) PTO; SCA: 426000; PA: EDB-97:086845; SN: 97001799048
DOE Contract Number:  
W-7405-ENG-48
Resource Type:
Patent
Resource Relation:
Other Information: PBD: 27 May 1997
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING NOT INCLUDED IN OTHER CATEGORIES; INTEGRATED CIRCUITS; SOLDERING; SUBSTRATES; EQUIPMENT; DESIGN

Citation Formats

Evans, L.B., and Malba, V. Pressure activated diaphragm bonder. United States: N. p., 1997. Web.
Evans, L.B., & Malba, V. Pressure activated diaphragm bonder. United States.
Evans, L.B., and Malba, V. Tue . "Pressure activated diaphragm bonder". United States.
@article{osti_489104,
title = {Pressure activated diaphragm bonder},
author = {Evans, L.B. and Malba, V.},
abstractNote = {A device is available for bonding one component to another, particularly for bonding electronic components of integrated circuits, such as chips, to a substrate. The bonder device in one embodiment includes a bottom metal block having a machined opening wherein a substrate is located, a template having machined openings which match solder patterns on the substrate, a thin diaphragm placed over the template after the chips have been positioned in the openings therein, and a top metal block positioned over the diaphragm and secured to the bottom block, with the diaphragm retained therebetween. The top block includes a countersink portion which extends over at least the area of the template and an opening through which a high pressure inert gas is supplied to exert uniform pressure distribution over the diaphragm to keep the chips in place during soldering. A heating means is provided to melt the solder patterns on the substrate and thereby solder the chips thereto. 4 figs.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1997},
month = {5}
}