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Title: METHOD OF ETCHING TANTALUM AND NIOBIUM FOR ELECTROPLATING.

Inventors:
;
Issue Date:
Research Org.:
Originating Research Org. not identified
OSTI Identifier:
4409262
Patent Number(s):
3314867
Assignee:
(to U. S. Atomic Energy Commission). DTIE; NSA-21-026779
NSA Number:
NSA-21-026779
Resource Type:
Patent
Resource Relation:
Other Information: Orig. Receipt Date: 31-DEC-67
Country of Publication:
United States
Language:
English
Subject:
N30120* -Metals, Ceramics, & Other Materials-Metals & Alloys-Preparation & Fabrication; ELECTROCHEMISTRY; ELECTRODEPOSITION; ETCHING; HYDROCHLORIC ACID; HYDROFLUORIC ACID; METALS; METHANOL; NIOBIUM; SURFACES; TANTALUM

Citation Formats

Seegmiller, R., and Gore, J.K. METHOD OF ETCHING TANTALUM AND NIOBIUM FOR ELECTROPLATING.. United States: N. p., 1967. Web.
Seegmiller, R., & Gore, J.K. METHOD OF ETCHING TANTALUM AND NIOBIUM FOR ELECTROPLATING.. United States.
Seegmiller, R., and Gore, J.K. Sun . "METHOD OF ETCHING TANTALUM AND NIOBIUM FOR ELECTROPLATING.". United States.
@article{osti_4409262,
title = {METHOD OF ETCHING TANTALUM AND NIOBIUM FOR ELECTROPLATING.},
author = {Seegmiller, R. and Gore, J.K.},
abstractNote = {},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1967},
month = {1}
}