VACUUM DIE-CASTING

Title: VACUUM DIE-CASTING

Full Record
Other Related Research

Inventors:: Plott, R F

Issue Date:: 1953-05-12

OSTI Identifier:: 4388493

Patent Number(s):: 2637882

Assignee:: U.S. Atomic Energy Commission

Patent Classifications (CPCs):: Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10S - TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS

B - PERFORMING OPERATIONS B22 - CASTING B22C - FOUNDRY MOULDING

Show more

Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10S - TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
Y10S425/044 - Rubber mold
Y10S264/78 - Processes of molding using vacuum

B - PERFORMING OPERATIONS B22 - CASTING B22C - FOUNDRY MOULDING
B22C9/06 - Permanent moulds for shaped castings

B - PERFORMING OPERATIONS B22 - CASTING B22D - CASTING OF METALS
B22D18/06 - Vacuum casting, i.e. making use of vacuum to fill the mould

Show less

NSA Number:: NSA-07-003667

Resource Type:: Patent

Resource Relation:: Other Information: Orig. Receipt Date: 31-DEC-53

Country of Publication:: United States

Language:: English

Subject:: PATENTS; CASTING; DIES; SEALS; VACUUM

Citation Formats


                    Plott, R F. VACUUM DIE-CASTING.  United States: N. p., 1953. 
        Web.

Copy to clipboard


                    Plott, R F. VACUUM DIE-CASTING.  United States.

Copy to clipboard


                    Plott, R F. Tue .  
        "VACUUM DIE-CASTING".  United States.

Copy to clipboard


                    
@article{osti_4388493,

  title        = {VACUUM DIE-CASTING},

  author       = {Plott, R F},

  abstractNote = {},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {1953},

  month        = {5}

}

Copy to clipboard

Patent:

Search for the full text at the U.S. Patent and Trademark Office

Save / Share:

Export Metadata

Save to My Library

Similar Records in DOE Patents and OSTI.GOV collections:

Vacuum die attach for integrated circuits

Patent Schmitt, Edward H [Livermore, CA]; Tuckerman, David B [Livermore, CA]

A thin film eutectic bond for attaching an integrated circuit die to a circuit substrate is formed by coating at least one bonding surface on the die and substrate with an alloying metal, assembling the die and substrate under compression loading, and heating the assembly to an alloying temperature in a vacuum. A very thin bond, 10 microns or less, which is substantially void free, is produced. These bonds have high reliability, good heat and electrical conduction, and high temperature tolerance. The bonds are formed in a vacuum chamber, using a positioning and loading fixture to compression load the die,more »« less
Full Text Available
Vacuum die attach for integrated circuits

Patent Schmitt, E H; Tuckerman, D B

A thin film eutectic bond for attaching an integrated circuit die to a circuit substrate is formed by coating at least one bonding surface on the die and substrate with an alloying metal, assembling the die and substrate under compression loading, and heating the assembly to an alloying temperature in a vacuum. A very thin bond, 10 microns or less, which is substantially void free, is produced. These bonds have high reliability, good heat and electrical conduction, and high temperature tolerance. The bonds are formed in a vacuum chamber, using a positioning and loading fixture to compression load the die,more »« less
The Effects of Silicon Addition on the Microstructure and Mechanical Properties of a Mg-Al-Sn Alloy Produced by Vacuum Assisted High Pressure Die Casting

Journal Article Klarner, Andrew D.; Miao, Jiashi; Sun, Weihua; ... - Metallurgical and Materials Transactions. A, Physical Metallurgy and Materials Science

Not provided.
DOI: https://doi.org/10.1007/s11661-018-5061-x
Vacuum die casting of silicon sheet for photovoltaic applications. First quarterly report, March 16-June 30, 1979

Technical Report

The obtective of this program is to develop a vacuum die-casting process for producing silicon sheet suitable for photovoltaic cells and to develop production techniques for optimization of polycrystallie silicon solar cell output. Efforts will examine process methods which are directed toward minimum cost processing of silicon into a quality suitable for producing solar cells with a terrestrial efficiency greater than 12% and having the potential to be scaled for large quantity production. In the vacuum die casting technique, silicon is melted under vacuum, and an evacuated die with a thin rectangular cavity is inserted into the melt. Liquid siliconmore »« less
DOI: https://doi.org/10.2172/5747083

Full Text Available
Vacuum die casting of silicon sheet for photovoltaic applications. Second quarterly report, 1 July-30 September 1979

Technical Report

The objective of this program is to develop a vacuum die-casting process for producing silicon sheet suitable for photovoltaic cells and to develop production techniques for optimization of polycrystalline silicon solar cell output. Efforts will examine process methods which are directed toward minimum cost processing of silicon into a quality suitable for producing solar cells with a terrestrial efficiency greater than 12% and having the potential to be scaled for large quantity production. In the vacuum die casting technique, silicon is melted under vacuum, and an evacuated die with a thin rectangular cavity is inserted into the melt. Liquid siliconmore »« less
DOI: https://doi.org/10.2172/5568369

Full Text Available

Similar Records