SOLDERING OF ALUMINUM BASE METALS
Abstract
This patent deals with the soldering of aluminum to metals of different types, such as copper, brass, and iron. This is accomplished by heating the aluminum metal to be soldered to slightly above 30 deg C, rubbing a small amount of metallic gallium into the part of the surface to be soldered, whereby an aluminum--gallium alloy forms on the surface, and then heating the aluminum piece to the melting point of lead--tin soft solder, applying lead--tin soft solder to this alloyed surface, and combining the aluminum with the other metal to which it is to be soldered.
- Inventors:
- Issue Date:
- OSTI Identifier:
- 4343443
- Patent Number(s):
- 2824365
- Assignee:
- U.S. Atomic Energy Commission
- Patent Classifications (CPCs):
-
B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23K - SOLDERING OR UNSOLDERING
Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10T - TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- NSA Number:
- NSA-12-010251
- Resource Type:
- Patent
- Resource Relation:
- Other Information: Orig. Receipt Date: 31-DEC-58
- Country of Publication:
- United States
- Language:
- English
- Subject:
- PATENTS; ALUMINUM; ALUMINUM ALLOYS; BRASS; COPPER; COPPER ALLOYS; GALLIUM; GALLIUM ALLOYS; HEATING; IRON; LEAD; MELTING POINTS; PATENT; SOLDERING; SURFACES; TIN; ZINC ALLOYS
Citation Formats
Erickson, G F. SOLDERING OF ALUMINUM BASE METALS. United States: N. p., 1958.
Web.
Erickson, G F. SOLDERING OF ALUMINUM BASE METALS. United States.
Erickson, G F. Tue .
"SOLDERING OF ALUMINUM BASE METALS". United States.
@article{osti_4343443,
title = {SOLDERING OF ALUMINUM BASE METALS},
author = {Erickson, G F},
abstractNote = {This patent deals with the soldering of aluminum to metals of different types, such as copper, brass, and iron. This is accomplished by heating the aluminum metal to be soldered to slightly above 30 deg C, rubbing a small amount of metallic gallium into the part of the surface to be soldered, whereby an aluminum--gallium alloy forms on the surface, and then heating the aluminum piece to the melting point of lead--tin soft solder, applying lead--tin soft solder to this alloyed surface, and combining the aluminum with the other metal to which it is to be soldered.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1958},
month = {2}
}
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