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Title: SOLDERING OF ALUMINUM BASE METALS

Abstract

This patent deals with the soldering of aluminum to metals of different types, such as copper, brass, and iron. This is accomplished by heating the aluminum metal to be soldered to slightly above 30 deg C, rubbing a small amount of metallic gallium into the part of the surface to be soldered, whereby an aluminum--gallium alloy forms on the surface, and then heating the aluminum piece to the melting point of lead--tin soft solder, applying lead--tin soft solder to this alloyed surface, and combining the aluminum with the other metal to which it is to be soldered.

Inventors:
Issue Date:
OSTI Identifier:
4343443
Patent Number(s):
2824365
Assignee:
U.S. Atomic Energy Commission
Patent Classifications (CPCs):
B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23K - SOLDERING OR UNSOLDERING
Y - NEW / CROSS SECTIONAL TECHNOLOGIES Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC Y10T - TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
NSA Number:
NSA-12-010251
Resource Type:
Patent
Resource Relation:
Other Information: Orig. Receipt Date: 31-DEC-58
Country of Publication:
United States
Language:
English
Subject:
PATENTS; ALUMINUM; ALUMINUM ALLOYS; BRASS; COPPER; COPPER ALLOYS; GALLIUM; GALLIUM ALLOYS; HEATING; IRON; LEAD; MELTING POINTS; PATENT; SOLDERING; SURFACES; TIN; ZINC ALLOYS

Citation Formats

Erickson, G F. SOLDERING OF ALUMINUM BASE METALS. United States: N. p., 1958. Web.
Erickson, G F. SOLDERING OF ALUMINUM BASE METALS. United States.
Erickson, G F. Tue . "SOLDERING OF ALUMINUM BASE METALS". United States.
@article{osti_4343443,
title = {SOLDERING OF ALUMINUM BASE METALS},
author = {Erickson, G F},
abstractNote = {This patent deals with the soldering of aluminum to metals of different types, such as copper, brass, and iron. This is accomplished by heating the aluminum metal to be soldered to slightly above 30 deg C, rubbing a small amount of metallic gallium into the part of the surface to be soldered, whereby an aluminum--gallium alloy forms on the surface, and then heating the aluminum piece to the melting point of lead--tin soft solder, applying lead--tin soft solder to this alloyed surface, and combining the aluminum with the other metal to which it is to be soldered.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1958},
month = {2}
}