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Title: BONDING ALUMINUM METALS

Abstract

A process is given for bonding aluminum to aluminum. Silicon powder is applied to at least one of the two surfaces of the two elements to be bonded, the two elements are assembled and rubbed against each other at room temperature whereby any oxide film is ruptured by the silicon crystals in the interface; thereafter heat and pressure are applied whereby an aluminum-silicon alloy is formed, squeezed out from the interface together with any oxide film, and the elements are bonded.

Inventors:
;
Issue Date:
Research Org.:
Originating Research Org. not identified
OSTI Identifier:
4002274
Patent Number(s):
2987816
Assignee:
U.S. Atomic Energy Commission DTIE; NSA-15-019821
NSA Number:
NSA-15-019821
Resource Type:
Patent
Resource Relation:
Other Information: Orig. Receipt Date: 31-DEC-61
Country of Publication:
United States
Language:
English
Subject:
METALS, CERAMICS, AND OTHER MATERIALS; ALUMINUM; ALUMINUM COMPOUNDS; ALUMINUM OXIDES; BONDING; CLEANING; COATING; FILMS; FRICTION; HEATING; POWDERS; PRESSURE; SILICIDES; SILICON

Citation Formats

Noland, R.A., and Walker, D.E. BONDING ALUMINUM METALS. United States: N. p., 1961. Web.
Noland, R.A., & Walker, D.E. BONDING ALUMINUM METALS. United States.
Noland, R.A., and Walker, D.E. Tue . "BONDING ALUMINUM METALS". United States.
@article{osti_4002274,
title = {BONDING ALUMINUM METALS},
author = {Noland, R.A. and Walker, D.E.},
abstractNote = {A process is given for bonding aluminum to aluminum. Silicon powder is applied to at least one of the two surfaces of the two elements to be bonded, the two elements are assembled and rubbed against each other at room temperature whereby any oxide film is ruptured by the silicon crystals in the interface; thereafter heat and pressure are applied whereby an aluminum-silicon alloy is formed, squeezed out from the interface together with any oxide film, and the elements are bonded.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1961},
month = {6}
}