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Title: Low-temperature hermetic sealing of optical fiber components

Abstract

A method for manufacturing low-temperature hermetically sealed optical fiber components is provided. The method comprises the steps of: inserting an optical fiber into a housing, the optical fiber having a glass core, a glass cladding and a protective buffer layer disposed around the core and cladding; heating the housing to a predetermined temperature, the predetermined temperature being below a melting point for the protective buffer layer and above a melting point of a solder; placing the solder in communication with the heated housing to allow the solder to form an eutectic and thereby fill a gap between the interior of the housing and the optical fiber; and cooling the housing to allow the solder to form a hermetic compression seal between the housing and the optical fiber. 5 figs.

Inventors:
Issue Date:
Research Org.:
EG & G Mound Applied Tech
Sponsoring Org.:
USDOE
OSTI Identifier:
392652
Patent Number(s):
5568585
Application Number:
PAN: 8-403,019
Assignee:
Dept. of Energy, Washington, DC (United States)
DOE Contract Number:  
AC04-88DP43495
Resource Type:
Patent
Resource Relation:
Other Information: PBD: 22 Oct 1996
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING NOT INCLUDED IN OTHER CATEGORIES; OPTICAL EQUIPMENT; MANUFACTURING; OPTICAL FIBERS; SOLDERING; SEALS

Citation Formats

Kramer, D P. Low-temperature hermetic sealing of optical fiber components. United States: N. p., 1996. Web.
Kramer, D P. Low-temperature hermetic sealing of optical fiber components. United States.
Kramer, D P. Tue . "Low-temperature hermetic sealing of optical fiber components". United States.
@article{osti_392652,
title = {Low-temperature hermetic sealing of optical fiber components},
author = {Kramer, D P},
abstractNote = {A method for manufacturing low-temperature hermetically sealed optical fiber components is provided. The method comprises the steps of: inserting an optical fiber into a housing, the optical fiber having a glass core, a glass cladding and a protective buffer layer disposed around the core and cladding; heating the housing to a predetermined temperature, the predetermined temperature being below a melting point for the protective buffer layer and above a melting point of a solder; placing the solder in communication with the heated housing to allow the solder to form an eutectic and thereby fill a gap between the interior of the housing and the optical fiber; and cooling the housing to allow the solder to form a hermetic compression seal between the housing and the optical fiber. 5 figs.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Oct 22 00:00:00 EDT 1996},
month = {Tue Oct 22 00:00:00 EDT 1996}
}

Patent:
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