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Title: Monolithic microchannel heatsink

A silicon wafer has slots sawn in it that allow diode laser bars to be mounted in contact with the silicon. Microchannels are etched into the back of the wafer to provide cooling of the diode bars. To facilitate getting the channels close to the diode bars, the channels are rotated from an angle perpendicular to the diode bars which allows increased penetration between the mounted diode bars. This invention enables the fabrication of monolithic silicon microchannel heatsinks for laser diodes. The heatsinks have low thermal resistance because of the close proximity of the microchannels to the laser diode being cooled. This allows high average power operation of two-dimensional laser diode arrays that have a high density of laser diode bars and therefore high optical power density. 9 figs.
Inventors:
; ;
Issue Date:
OSTI Identifier:
372583
Assignee:
Univ. of California, Oakland, CA (United States) PTO; SCA: 426002; PA: EDB-96:144783; SN: 96001644975
Patent Number(s):
US 5,548,605/A/
Application Number:
PAN: 8-440,595
Contract Number:
W-7405-ENG-48
Resource Relation:
Other Information: PBD: 20 Aug 1996
Research Org:
University of California
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING NOT INCLUDED IN OTHER CATEGORIES; SEMICONDUCTOR LASERS; HEAT SINKS; DESIGN; MINIATURIZATION; ETCHING; ALIGNMENT; HEAT TRANSFER

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