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Title: Monolithic microchannel heatsink

Abstract

A silicon wafer has slots sawn in it that allow diode laser bars to be mounted in contact with the silicon. Microchannels are etched into the back of the wafer to provide cooling of the diode bars. To facilitate getting the channels close to the diode bars, the channels are rotated from an angle perpendicular to the diode bars which allows increased penetration between the mounted diode bars. This invention enables the fabrication of monolithic silicon microchannel heatsinks for laser diodes. The heatsinks have low thermal resistance because of the close proximity of the microchannels to the laser diode being cooled. This allows high average power operation of two-dimensional laser diode arrays that have a high density of laser diode bars and therefore high optical power density. 9 figs.

Inventors:
; ;
Issue Date:
Research Org.:
University of California
OSTI Identifier:
372583
Patent Number(s):
5,548,605
Application Number:
PAN: 8-440,595
Assignee:
Univ. of California, Oakland, CA (United States)
DOE Contract Number:  
W-7405-ENG-48
Resource Type:
Patent
Resource Relation:
Other Information: PBD: 20 Aug 1996
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING NOT INCLUDED IN OTHER CATEGORIES; SEMICONDUCTOR LASERS; HEAT SINKS; DESIGN; MINIATURIZATION; ETCHING; ALIGNMENT; HEAT TRANSFER

Citation Formats

Benett, W J, Beach, R J, and Ciarlo, D R. Monolithic microchannel heatsink. United States: N. p., 1996. Web.
Benett, W J, Beach, R J, & Ciarlo, D R. Monolithic microchannel heatsink. United States.
Benett, W J, Beach, R J, and Ciarlo, D R. Tue . "Monolithic microchannel heatsink". United States.
@article{osti_372583,
title = {Monolithic microchannel heatsink},
author = {Benett, W J and Beach, R J and Ciarlo, D R},
abstractNote = {A silicon wafer has slots sawn in it that allow diode laser bars to be mounted in contact with the silicon. Microchannels are etched into the back of the wafer to provide cooling of the diode bars. To facilitate getting the channels close to the diode bars, the channels are rotated from an angle perpendicular to the diode bars which allows increased penetration between the mounted diode bars. This invention enables the fabrication of monolithic silicon microchannel heatsinks for laser diodes. The heatsinks have low thermal resistance because of the close proximity of the microchannels to the laser diode being cooled. This allows high average power operation of two-dimensional laser diode arrays that have a high density of laser diode bars and therefore high optical power density. 9 figs.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1996},
month = {8}
}