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Title: Load regulating expansion fixture

Abstract

A free standing self contained device for bonding ultra thin metallic films, such as 0.001 inch beryllium foils is disclosed. The device will regulate to a predetermined load for solid state bonding when heated to a bonding temperature. The device includes a load regulating feature, whereby the expansion stresses generated for bonding are regulated and self adjusting. The load regulator comprises a pair of friction isolators with a plurality of annealed copper members located therebetween. The device, with the load regulator, will adjust to and maintain a stress level needed to successfully and economically complete a leak tight bond without damaging thin foils or other delicate components. 1 fig.

Inventors:
;
Issue Date:
Research Org.:
University of California
Sponsoring Org.:
USDOE, Washington, DC (United States)
OSTI Identifier:
321210
Patent Number(s):
5,848,746
Application Number:
PAN: 8-586,129; TRN: 99:003298
Assignee:
Univ. of California, Oakland, CA (United States) PTO; SCA: 360101; PA: EDB-99:030021; SN: 99002058493
DOE Contract Number:  
W-7405-ENG-48
Resource Type:
Patent
Resource Relation:
Other Information: PBD: 15 Dec 1998
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; BERYLLIUM; THIN FILMS; SELF-WELDING; DESIGN; WELDING MACHINES

Citation Formats

Wagner, L.M., and Strum, M.J. Load regulating expansion fixture. United States: N. p., 1998. Web.
Wagner, L.M., & Strum, M.J. Load regulating expansion fixture. United States.
Wagner, L.M., and Strum, M.J. Tue . "Load regulating expansion fixture". United States.
@article{osti_321210,
title = {Load regulating expansion fixture},
author = {Wagner, L.M. and Strum, M.J.},
abstractNote = {A free standing self contained device for bonding ultra thin metallic films, such as 0.001 inch beryllium foils is disclosed. The device will regulate to a predetermined load for solid state bonding when heated to a bonding temperature. The device includes a load regulating feature, whereby the expansion stresses generated for bonding are regulated and self adjusting. The load regulator comprises a pair of friction isolators with a plurality of annealed copper members located therebetween. The device, with the load regulator, will adjust to and maintain a stress level needed to successfully and economically complete a leak tight bond without damaging thin foils or other delicate components. 1 fig.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1998},
month = {12}
}