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Title: Electroless copper plating

Abstract

An optimized electroless copper plating technique is described suitable for plating electroless copper upon ceramics. 12 figs.

Inventors:
Issue Date:
Research Org.:
Honeywell International Inc
Sponsoring Org.:
USDOE, Washington, DC (United States)
OSTI Identifier:
321167
Patent Number(s):
5,849,355
Application Number:
PAN: 8-717,195
Assignee:
AlliedSignal Inc., Morristown, NJ (United States) PTO; SCA: 360101; PA: EDB-99:030020; SN: 99002058489
DOE Contract Number:  
AC04-76DP00613
Resource Type:
Patent
Resource Relation:
Other Information: PBD: 15 Dec 1998
Country of Publication:
United States
Language:
English
Subject:
36 MATERIALS SCIENCE; COPPER; ELECTROPLATING; ELECTROLYTIC CELLS; DESIGN; CERAMICS; SURFACE COATING

Citation Formats

McHenry, M.R. Electroless copper plating. United States: N. p., 1998. Web.
McHenry, M.R. Electroless copper plating. United States.
McHenry, M.R. Tue . "Electroless copper plating". United States.
@article{osti_321167,
title = {Electroless copper plating},
author = {McHenry, M.R.},
abstractNote = {An optimized electroless copper plating technique is described suitable for plating electroless copper upon ceramics. 12 figs.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1998},
month = {12}
}