Electroless copper plating
Abstract
An optimized electroless copper plating technique is described suitable for plating electroless copper upon ceramics. 12 figs.
- Inventors:
- Issue Date:
- Research Org.:
- Honeywell International Inc
- Sponsoring Org.:
- USDOE, Washington, DC (United States)
- OSTI Identifier:
- 321167
- Patent Number(s):
- 5849355
- Application Number:
- PAN: 8-717,195
- Assignee:
- AlliedSignal Inc., Morristown, NJ (United States)
- DOE Contract Number:
- AC04-76DP00613
- Resource Type:
- Patent
- Resource Relation:
- Other Information: PBD: 15 Dec 1998
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 36 MATERIALS SCIENCE; COPPER; ELECTROPLATING; ELECTROLYTIC CELLS; DESIGN; CERAMICS; SURFACE COATING
Citation Formats
McHenry, M R. Electroless copper plating. United States: N. p., 1998.
Web.
McHenry, M R. Electroless copper plating. United States.
McHenry, M R. Tue .
"Electroless copper plating". United States.
@article{osti_321167,
title = {Electroless copper plating},
author = {McHenry, M R},
abstractNote = {An optimized electroless copper plating technique is described suitable for plating electroless copper upon ceramics. 12 figs.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1998},
month = {12}
}
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