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Title: Apparatus and method for measuring the thickness of a semiconductor wafer

Apparatus for measuring thicknesses of semiconductor wafers is discussed, comprising: housing means for supporting a wafer in a light-tight environment; a light source mounted to the housing at one side of the wafer to emit light of a predetermined wavelength to normally impinge the wafer; a light detector supported at a predetermined distance from a side of the wafer opposite the side on which a light source impinges and adapted to receive light transmitted through the wafer; and means for measuring the transmitted light. 4 figs.
Inventors:
Issue Date:
OSTI Identifier:
27720
Assignee:
CHO; SCA: 440800; PA: EDB-95:059259; SN: 95001354426
Patent Number(s):
US 5,396,332/A/
Application Number:
PAN: 8-014,642
Contract Number:
AC02-83CH10093
Resource Relation:
Other Information: PBD: 7 Mar 1995
Research Org:
Midwest Research Institute; National Renewable Energy Lab. (NREL), Golden, CO (United States)
Sponsoring Org:
USDOE
Country of Publication:
United States
Language:
English
Subject:
44 INSTRUMENTATION, INCLUDING NUCLEAR AND PARTICLE DETECTORS; SEMICONDUCTOR MATERIALS; THICKNESS; THICKNESS GAGES; DESIGN; MATERIALS HANDLING EQUIPMENT; LIGHT TRANSMISSION; VISIBLE RADIATION