Apparatus and method for measuring the thickness of a semiconductor wafer

Title: Apparatus and method for measuring the thickness of a semiconductor wafer

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Abstract

Apparatus for measuring thicknesses of semiconductor wafers is discussed, comprising: housing means for supporting a wafer in a light-tight environment; a light source mounted to the housing at one side of the wafer to emit light of a predetermined wavelength to normally impinge the wafer; a light detector supported at a predetermined distance from a side of the wafer opposite the side on which a light source impinges and adapted to receive light transmitted through the wafer; and means for measuring the transmitted light. 4 figs.

Inventors:: Ciszek, T F

Issue Date:: 1995-03-07

Research Org.:: Midwest Research Institute, Kansas City, MO (United States); National Renewable Energy Lab. (NREL), Golden, CO (United States)

Sponsoring Org.:: USDOE

OSTI Identifier:: 27720

Patent Number(s):: 5396332

Application Number:: PAN: 8-014,642

Assignee:: CHO; SCA: 440800; PA: EDB-95:059259; SN: 95001354426

DOE Contract Number:: AC02-83CH10093

Resource Type:: Patent

Resource Relation:: Other Information: PBD: 7 Mar 1995

Country of Publication:: United States

Language:: English

Subject:: 44 INSTRUMENTATION, INCLUDING NUCLEAR AND PARTICLE DETECTORS; SEMICONDUCTOR MATERIALS; THICKNESS; THICKNESS GAGES; DESIGN; MATERIALS HANDLING EQUIPMENT; LIGHT TRANSMISSION; VISIBLE RADIATION

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                    Ciszek, T F. Apparatus and method for measuring the thickness of a semiconductor wafer.  United States: N. p., 1995. 
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                    Ciszek, T F. Apparatus and method for measuring the thickness of a semiconductor wafer.  United States.

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                    Ciszek, T F. Tue .  
        "Apparatus and method for measuring the thickness of a semiconductor wafer".  United States.

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@article{osti_27720,

  title        = {Apparatus and method for measuring the thickness of a semiconductor wafer},

  author       = {Ciszek, T F},

  abstractNote = {Apparatus for measuring thicknesses of semiconductor wafers is discussed, comprising: housing means for supporting a wafer in a light-tight environment; a light source mounted to the housing at one side of the wafer to emit light of a predetermined wavelength to normally impinge the wafer; a light detector supported at a predetermined distance from a side of the wafer opposite the side on which a light source impinges and adapted to receive light transmitted through the wafer; and means for measuring the transmitted light. 4 figs.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {1995},

  month        = {3}

}

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