Apparatus and method for measuring the thickness of a semiconductor wafer

Title: Apparatus and method for measuring the thickness of a semiconductor wafer

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Apparatus for measuring thicknesses of semiconductor wafers is discussed, comprising: housing means for supporting a wafer in a light-tight environment; a light source mounted to the housing at one side of the wafer to emit light of a predetermined wavelength to normally impinge the wafer; a light detector supported at a predetermined distance from a side of the wafer opposite the side on which a light source impinges and adapted to receive light transmitted through the wafer; and means for measuring the transmitted light. 4 figs.

Inventors:: Ciszek, T.F.

Issue Date:: 1995-03-07

OSTI Identifier:: 27720

Assignee:: CHO; SCA: 440800; PA: EDB-95:059259; SN: 95001354426

Patent Number(s):: US 5,396,332/A/

Application Number:: PAN: 8-014,642

Contract Number:: AC02-83CH10093

Resource Relation:: Other Information: PBD: 7 Mar 1995

Research Org:: Midwest Research Institute; National Renewable Energy Lab. (NREL), Golden, CO (United States)

Sponsoring Org:: USDOE

Country of Publication:: United States

Language:: English

Subject:: 44 INSTRUMENTATION, INCLUDING NUCLEAR AND PARTICLE DETECTORS; SEMICONDUCTOR MATERIALS; THICKNESS; THICKNESS GAGES; DESIGN; MATERIALS HANDLING EQUIPMENT; LIGHT TRANSMISSION; VISIBLE RADIATION

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