Apparatus and method for measuring the thickness of a semiconductor wafer
Abstract
Apparatus for measuring thicknesses of semiconductor wafers is discussed, comprising: housing means for supporting a wafer in a light-tight environment; a light source mounted to the housing at one side of the wafer to emit light of a predetermined wavelength to normally impinge the wafer; a light detector supported at a predetermined distance from a side of the wafer opposite the side on which a light source impinges and adapted to receive light transmitted through the wafer; and means for measuring the transmitted light. 4 figs.
- Inventors:
- Issue Date:
- Research Org.:
- Midwest Research Institute, Kansas City, MO (United States); National Renewable Energy Lab. (NREL), Golden, CO (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 27720
- Patent Number(s):
- 5396332
- Application Number:
- PAN: 8-014,642
- Assignee:
- CHO; SCA: 440800; PA: EDB-95:059259; SN: 95001354426
- DOE Contract Number:
- AC02-83CH10093
- Resource Type:
- Patent
- Resource Relation:
- Other Information: PBD: 7 Mar 1995
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 44 INSTRUMENTATION, INCLUDING NUCLEAR AND PARTICLE DETECTORS; SEMICONDUCTOR MATERIALS; THICKNESS; THICKNESS GAGES; DESIGN; MATERIALS HANDLING EQUIPMENT; LIGHT TRANSMISSION; VISIBLE RADIATION
Citation Formats
Ciszek, T F. Apparatus and method for measuring the thickness of a semiconductor wafer. United States: N. p., 1995.
Web.
Ciszek, T F. Apparatus and method for measuring the thickness of a semiconductor wafer. United States.
Ciszek, T F. Tue .
"Apparatus and method for measuring the thickness of a semiconductor wafer". United States.
@article{osti_27720,
title = {Apparatus and method for measuring the thickness of a semiconductor wafer},
author = {Ciszek, T F},
abstractNote = {Apparatus for measuring thicknesses of semiconductor wafers is discussed, comprising: housing means for supporting a wafer in a light-tight environment; a light source mounted to the housing at one side of the wafer to emit light of a predetermined wavelength to normally impinge the wafer; a light detector supported at a predetermined distance from a side of the wafer opposite the side on which a light source impinges and adapted to receive light transmitted through the wafer; and means for measuring the transmitted light. 4 figs.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1995},
month = {3}
}