skip to main content
DOE Patents title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Apparatus and method for measuring the thickness of a semiconductor wafer

Abstract

Apparatus for measuring thicknesses of semiconductor wafers is discussed, comprising: housing means for supporting a wafer in a light-tight environment; a light source mounted to the housing at one side of the wafer to emit light of a predetermined wavelength to normally impinge the wafer; a light detector supported at a predetermined distance from a side of the wafer opposite the side on which a light source impinges and adapted to receive light transmitted through the wafer; and means for measuring the transmitted light. 4 figs.

Inventors:
Issue Date:
Research Org.:
Midwest Research Institute, Kansas City, MO (United States); National Renewable Energy Lab. (NREL), Golden, CO (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
27720
Patent Number(s):
5,396,332
Application Number:
PAN: 8-014,642
Assignee:
CHO; SCA: 440800; PA: EDB-95:059259; SN: 95001354426
DOE Contract Number:  
AC02-83CH10093
Resource Type:
Patent
Resource Relation:
Other Information: PBD: 7 Mar 1995
Country of Publication:
United States
Language:
English
Subject:
44 INSTRUMENTATION, INCLUDING NUCLEAR AND PARTICLE DETECTORS; SEMICONDUCTOR MATERIALS; THICKNESS; THICKNESS GAGES; DESIGN; MATERIALS HANDLING EQUIPMENT; LIGHT TRANSMISSION; VISIBLE RADIATION

Citation Formats

Ciszek, T F. Apparatus and method for measuring the thickness of a semiconductor wafer. United States: N. p., 1995. Web.
Ciszek, T F. Apparatus and method for measuring the thickness of a semiconductor wafer. United States.
Ciszek, T F. Tue . "Apparatus and method for measuring the thickness of a semiconductor wafer". United States.
@article{osti_27720,
title = {Apparatus and method for measuring the thickness of a semiconductor wafer},
author = {Ciszek, T F},
abstractNote = {Apparatus for measuring thicknesses of semiconductor wafers is discussed, comprising: housing means for supporting a wafer in a light-tight environment; a light source mounted to the housing at one side of the wafer to emit light of a predetermined wavelength to normally impinge the wafer; a light detector supported at a predetermined distance from a side of the wafer opposite the side on which a light source impinges and adapted to receive light transmitted through the wafer; and means for measuring the transmitted light. 4 figs.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1995},
month = {3}
}