Method of forming a leak proof plasma sprayed interconnection layer on an electrode of an electrochemical cell
Abstract
A dense, substantially gas-tight, electrically conductive interconnection layer is formed on an electrode structure of an electrochemical cell by: (A) providing an electrode structure; (B) forming on a selected portion of the electrode surface, an interconnection layer having the general formula La{sub 1{minus}x}M{sub x}Cr{sub 1{minus}y}N{sub y}O{sub 3}, where M is a dopant selected from the group of Ca, Sr, Ba, and mixtures thereof, and where N is a dopant selected from the group of Mg, Co, Ni, Al, and mixtures thereof, and where x and y are each independently about 0.075--0.25, by thermally spraying, preferably plasma arc spraying, a flux added interconnection spray powder, preferably agglomerated, the flux added powder comprising flux particles, preferably including dopant, preferably (CaO){sub 12}(Al{sub 2}O{sub 3}){sub 7} flux particles including Ca and Al dopant, and LaCrO{sub 3} interconnection particles, preferably undoped LaCrO{sub 3}, to form a dense and substantially gas-tight interconnection material bonded to the electrode structure by a single plasma spraying step; and (C) heat treating the interconnection layer at from about 1,200 to 1,350 C to further densify and heal the micro-cracks and macro-cracks of the thermally sprayed interconnection layer. The result is a substantially gas-tight, highly doped, electrically conductive interconnection material bondedmore »
- Inventors:
- Issue Date:
- Research Org.:
- Westinghouse Electric Corporation
- OSTI Identifier:
- 27707
- Patent Number(s):
- 5391440
- Application Number:
- PAN: 8-195,335
- Assignee:
- Westinghouse Electric Corp., Pittsburgh, PA (United States)
- DOE Contract Number:
- FC21-91MC28055
- Resource Type:
- Patent
- Resource Relation:
- Other Information: PBD: 21 Feb 1995
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 30 DIRECT ENERGY CONVERSION; SOLID ELECTROLYTE FUEL CELLS; ELECTRODES; FABRICATION; COATINGS; PLASMA ARC SPRAYING; LANTHANUM OXIDES; CHROMIUM OXIDES; DOPED MATERIALS; CALCIUM OXIDES; STRONTIUM OXIDES; BARIUM OXIDES; MAGNESIUM OXIDES; COBALT OXIDES; NICKEL OXIDES; ALUMINIUM OXIDES; LANTHANUM COMPOUNDS; HEAT TREATMENTS; ELECTRIC CONDUCTIVITY
Citation Formats
Kuo, L J.H., and Vora, S D. Method of forming a leak proof plasma sprayed interconnection layer on an electrode of an electrochemical cell. United States: N. p., 1995.
Web.
Kuo, L J.H., & Vora, S D. Method of forming a leak proof plasma sprayed interconnection layer on an electrode of an electrochemical cell. United States.
Kuo, L J.H., and Vora, S D. Tue .
"Method of forming a leak proof plasma sprayed interconnection layer on an electrode of an electrochemical cell". United States.
@article{osti_27707,
title = {Method of forming a leak proof plasma sprayed interconnection layer on an electrode of an electrochemical cell},
author = {Kuo, L J.H. and Vora, S D},
abstractNote = {A dense, substantially gas-tight, electrically conductive interconnection layer is formed on an electrode structure of an electrochemical cell by: (A) providing an electrode structure; (B) forming on a selected portion of the electrode surface, an interconnection layer having the general formula La{sub 1{minus}x}M{sub x}Cr{sub 1{minus}y}N{sub y}O{sub 3}, where M is a dopant selected from the group of Ca, Sr, Ba, and mixtures thereof, and where N is a dopant selected from the group of Mg, Co, Ni, Al, and mixtures thereof, and where x and y are each independently about 0.075--0.25, by thermally spraying, preferably plasma arc spraying, a flux added interconnection spray powder, preferably agglomerated, the flux added powder comprising flux particles, preferably including dopant, preferably (CaO){sub 12}(Al{sub 2}O{sub 3}){sub 7} flux particles including Ca and Al dopant, and LaCrO{sub 3} interconnection particles, preferably undoped LaCrO{sub 3}, to form a dense and substantially gas-tight interconnection material bonded to the electrode structure by a single plasma spraying step; and (C) heat treating the interconnection layer at from about 1,200 to 1,350 C to further densify and heal the micro-cracks and macro-cracks of the thermally sprayed interconnection layer. The result is a substantially gas-tight, highly doped, electrically conductive interconnection material bonded to the electrode structure. The electrode structure can be an air electrode, and a solid electrolyte layer can be applied to the unselected portion of the air electrode, and further a fuel electrode can be applied to the solid electrolyte, to form an electrochemical cell for generation of electrical power. 4 figs.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1995},
month = {2}
}