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Title: Method and system for evaluating integrity of adherence of a conductor bond to a mating surface of a substrate

A method of evaluating integrity of adherence of a conductor bond to a substrate includes: (a) impinging a plurality of light sources onto a substrate; (b) detecting optical reflective signatures emanating from the substrate from the impinged light; (c) determining location of a selected conductor bond on the substrate from the detected reflective signatures; (d) determining a target site on the selected conductor bond from the detected reflective signatures; (e) optically imparting an elastic wave at the target site through the selected conductor bond and into the substrate; (f) optically detecting an elastic wave signature emanating from the substrate resulting from the optically imparting step; and (g) determining integrity of adherence of the selected conductor bond to the substrate from the detected elastic wave signature emanating from the substrate. A system is disclosed which is capable of conducting the method. 13 figs.
Inventors:
;
Issue Date:
OSTI Identifier:
253871
Assignee:
Lockheed Idaho Technologies Co., Idaho Falls, ID (United States) PTO; SCA: 420500; PA: EDB-96:107672; SN: 96001614005
Patent Number(s):
US 5,535,006/A/
Application Number:
PAN: 8-250,078
Contract Number:
AC07-76ID01570
Resource Relation:
Other Information: PBD: 9 Jul 1996
Research Org:
EG & G Idaho Inc
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING NOT INCLUDED IN OTHER CATEGORIES; JOINTS; NONDESTRUCTIVE TESTING; RELIABILITY; ELECTRIC CONDUCTORS; ADHESION; BONDING; VISIBLE RADIATION; REFLECTION