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Title: Method and system for evaluating integrity of adherence of a conductor bond to a mating surface of a substrate

Abstract

A method of evaluating integrity of adherence of a conductor bond to a substrate includes: (a) impinging a plurality of light sources onto a substrate; (b) detecting optical reflective signatures emanating from the substrate from the impinged light; (c) determining location of a selected conductor bond on the substrate from the detected reflective signatures; (d) determining a target site on the selected conductor bond from the detected reflective signatures; (e) optically imparting an elastic wave at the target site through the selected conductor bond and into the substrate; (f) optically detecting an elastic wave signature emanating from the substrate resulting from the optically imparting step; and (g) determining integrity of adherence of the selected conductor bond to the substrate from the detected elastic wave signature emanating from the substrate. A system is disclosed which is capable of conducting the method. 13 figs.

Inventors:
;
Issue Date:
Research Org.:
EG & G Idaho Inc
OSTI Identifier:
253871
Patent Number(s):
5,535,006
Application Number:
PAN: 8-250,078
Assignee:
Lockheed Idaho Technologies Co., Idaho Falls, ID (United States)
DOE Contract Number:  
AC07-76ID01570
Resource Type:
Patent
Resource Relation:
Other Information: PBD: 9 Jul 1996
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING NOT INCLUDED IN OTHER CATEGORIES; JOINTS; NONDESTRUCTIVE TESTING; RELIABILITY; ELECTRIC CONDUCTORS; ADHESION; BONDING; VISIBLE RADIATION; REFLECTION

Citation Formats

Telschow, K L, and Siu, B K. Method and system for evaluating integrity of adherence of a conductor bond to a mating surface of a substrate. United States: N. p., 1996. Web.
Telschow, K L, & Siu, B K. Method and system for evaluating integrity of adherence of a conductor bond to a mating surface of a substrate. United States.
Telschow, K L, and Siu, B K. Tue . "Method and system for evaluating integrity of adherence of a conductor bond to a mating surface of a substrate". United States.
@article{osti_253871,
title = {Method and system for evaluating integrity of adherence of a conductor bond to a mating surface of a substrate},
author = {Telschow, K L and Siu, B K},
abstractNote = {A method of evaluating integrity of adherence of a conductor bond to a substrate includes: (a) impinging a plurality of light sources onto a substrate; (b) detecting optical reflective signatures emanating from the substrate from the impinged light; (c) determining location of a selected conductor bond on the substrate from the detected reflective signatures; (d) determining a target site on the selected conductor bond from the detected reflective signatures; (e) optically imparting an elastic wave at the target site through the selected conductor bond and into the substrate; (f) optically detecting an elastic wave signature emanating from the substrate resulting from the optically imparting step; and (g) determining integrity of adherence of the selected conductor bond to the substrate from the detected elastic wave signature emanating from the substrate. A system is disclosed which is capable of conducting the method. 13 figs.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {1996},
month = {7}
}