System and method for organic electronic device patterning
Abstract
A method for fabricating an organic electronic device comprises providing a plurality of photoresist structures on a substrate, the substrate having a first electrode layer, the photoresist structures having a bottom surface attached to the substrate and a top surface opposite the bottom surface, the top surface having a dimension greater than a dimension of the bottom surface, positioning a mask over the structures, the mask having a plurality of openings, and depositing an emissive material over the substrate through at least one of the plurality of openings to form at least one emissive element. An organic electronic device and a method of fabricating an organic electronic component are also described.
- Inventors:
- Issue Date:
- Research Org.:
- Univ. of Michigan, Ann Arbor, MI (United States)
- Sponsoring Org.:
- USDOE; US Air Force Office of Scientific Research (AFOSR)
- OSTI Identifier:
- 2293933
- Patent Number(s):
- 11832504
- Application Number:
- 17/100,003
- Assignee:
- The Regents of the University of Michigan (Ann Arbor, MI)
- DOE Contract Number:
- EE0008723; FA9550-18-1-0162; SC0017971
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 11/20/2020
- Country of Publication:
- United States
- Language:
- English
Citation Formats
Forrest, Stephen R. System and method for organic electronic device patterning. United States: N. p., 2023.
Web.
Forrest, Stephen R. System and method for organic electronic device patterning. United States.
Forrest, Stephen R. Tue .
"System and method for organic electronic device patterning". United States. https://www.osti.gov/servlets/purl/2293933.
@article{osti_2293933,
title = {System and method for organic electronic device patterning},
author = {Forrest, Stephen R.},
abstractNote = {A method for fabricating an organic electronic device comprises providing a plurality of photoresist structures on a substrate, the substrate having a first electrode layer, the photoresist structures having a bottom surface attached to the substrate and a top surface opposite the bottom surface, the top surface having a dimension greater than a dimension of the bottom surface, positioning a mask over the structures, the mask having a plurality of openings, and depositing an emissive material over the substrate through at least one of the plurality of openings to form at least one emissive element. An organic electronic device and a method of fabricating an organic electronic component are also described.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2023},
month = {11}
}
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