Conductive trace interconnection tape
Abstract
A conductive trace interconnect tape for use with a printed circuit board or a flexible circuit substrate comprises a top insulating layer, an electrically conductive layer, and a bottom insulating layer. The top insulating layer is formed from electrically insulating material and is configured to provide electrical isolation from electrically conductive objects that are positioned on top of the conductive trace interconnect tape. The electrically conductive layer is positioned underneath the top insulating layer. The electrically conductive layer is formed from electrically conductive material and includes electrical interconnect traces, electrical component pads, or electrically conductive planar portions. The bottom insulating layer is positioned underneath the electrically conductive layer. The bottom insulating layer is formed from electrically insulating material and is configured to provide electrical isolation from electrically conductive objects that are positioned on the printed circuit board or flexible circuit substrate.
- Inventors:
- Issue Date:
- Research Org.:
- Kansas City Plant (KCP), Kansas City, MO (United States)
- Sponsoring Org.:
- USDOE National Nuclear Security Administration (NNSA)
- OSTI Identifier:
- 2293849
- Patent Number(s):
- 11812553
- Application Number:
- 17/731,621
- Assignee:
- Honeywell Federal Manufacturing & Technologies, LLC (Kansas City, MO)
- DOE Contract Number:
- NA0002839
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 04/28/2022
- Country of Publication:
- United States
- Language:
- English
Citation Formats
Hatch, Stephen McGarry, and Hatch, Jonathan Douglas. Conductive trace interconnection tape. United States: N. p., 2023.
Web.
Hatch, Stephen McGarry, & Hatch, Jonathan Douglas. Conductive trace interconnection tape. United States.
Hatch, Stephen McGarry, and Hatch, Jonathan Douglas. Tue .
"Conductive trace interconnection tape". United States. https://www.osti.gov/servlets/purl/2293849.
@article{osti_2293849,
title = {Conductive trace interconnection tape},
author = {Hatch, Stephen McGarry and Hatch, Jonathan Douglas},
abstractNote = {A conductive trace interconnect tape for use with a printed circuit board or a flexible circuit substrate comprises a top insulating layer, an electrically conductive layer, and a bottom insulating layer. The top insulating layer is formed from electrically insulating material and is configured to provide electrical isolation from electrically conductive objects that are positioned on top of the conductive trace interconnect tape. The electrically conductive layer is positioned underneath the top insulating layer. The electrically conductive layer is formed from electrically conductive material and includes electrical interconnect traces, electrical component pads, or electrically conductive planar portions. The bottom insulating layer is positioned underneath the electrically conductive layer. The bottom insulating layer is formed from electrically insulating material and is configured to provide electrical isolation from electrically conductive objects that are positioned on the printed circuit board or flexible circuit substrate.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2023},
month = {11}
}
Save to My Library
You must Sign In or Create an Account in order to save documents to your library.
Works referenced in this record:
Flexible metal-clad dielectrics, having beryllium copper foil
patent, April 2000
- Yoshioka, Toshio; Yamauchi, Akihito
- US Patent Document 6,049,041
Wiring board and method for producing the same
patent, October 2008
- Shimoishizaka, Nozomi; Koutani, Nobuyuki; Nagao, Kouichi
- US Patent Document 7,442,074
Flexible flat cable with insulating layer having distinct adhesives on opposing faces
patent, August 2006
- Stotz, Darin
- US Patent Document 7,091,422
Method of fabricating tape attachment chip-on-board assemblies
patent, September 2002
- Jiang, Tongbi
- US Patent Document 6,455,354
Controlling impedance and thickness variations for multilayer electronic structures
patent, April 2011
- Dangler, John R.; Doyle, Matthew S.
- US Patent Document 7,921,403
Connecting device for flexible electrical connection of circuit boards
patent, November 2004
- Kurle, Juergen; Schmich, Franz; Klink, Michael
- US Patent Document 6,811,409
Rapid PCB prototyping by selective adhesion
patent, October 2017
- Hatch, Jonathan Douglas; Hatch, Stephen McGarry
- US Patent Document 9,795,035
Board-to-board electrical coupling with conductive band
patent, July 2003
- Dent, David E.
- US Patent Document 6,594,152
Laminated conductive material, multiple conductor cables and methods of manufacturing such cables
patent, December 1993
- Murphy, Davis; Bonnette, Dennis A.; Stearns, Thomas H.
- US Patent Document 5,274,195
Flexible tape having stripes of electrically conductive particles for making multiple connections
patent, October 1985
- King, Timothy W.
- US Patent Document 4,546,037
Tape carrier for TAB
patent, April 2007
- Naito, Toshiki; Yamazaki, Hiroshi; Omote, Toshihiko
- US Patent Document 7,205,482
Flexible wiring board
patent, December 2001
- Miyaake, Chiharu; Miyake, Yasufumi; Terada, Tetsuya
- US Patent Document 6,333,466
Heat-resistant, flex-resistant flexible flat cable and process for producing the same
patent, February 2003
- Yamanobe, Hiroshi; Ichikawa, Takaaki; Aoyama, Seigi
- US Patent Document 6,521,838
Electrically conductive adhesive tape
patent, February 1992
- Calhoun, Clyde D.; Berg, James G.; Koskenmaki, David C.
- US Patent Document 5,087,494
Wiring unit
patent, October 2002
- Yamanashi, Makoto; Murakami, Takao; Suzuki, Hiroyuki
- US Patent Document 6,469,261
Flexible printed circuit with EMI protection
patent, July 2004
- Yamada, Tsukasa; Sugiyama, Ren; Fujii, Masanobu
- US Patent Document 6,768,052
Bundle Division Structure for Flexible Circuit Cable
patent-application, April 2014
- Su, Kuo-Fu
- US Patent Application 14/039112; 20140097021 A1
Manufacturing method of electronic component, electronic component, and manufacturing apparatus of electronic component
patent, April 2018
- Eifuku, Hideki; Tie, Wanyu; Munakata, Hironori
- US Patent Document 9,949,380
Kit for electrifying an assembly of bricks in a brick building system
patent, October 2017
- Hellenga, Rachel
- US Patent Document 9,782,686