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Title: Radio frequency tuning using a multichip module electrical interconnect structure

Abstract

A method for tuning a resonant frequency of wireless communication circuitry on a multichip module including a plurality of chips includes applying an electrical insulator to an upper surface of the multichip module; creating a plurality of openings in the electrical insulator, each opening being positioned at a successive one of the bond pads to be electrically connected to create a plurality of exposed bond pads; applying metal to each exposed bond pad to form a successive one of a plurality of interconnect bases; removing a portion of the layer of photoresist to create a plurality of bridge supports, each bridge support positioned between a successive pair of interconnect bases; applying metal to each bridge support and associated interconnect bases to form a successive one of the interconnect traces; removing the bridge supports; and disconnecting one or more of the interconnect traces as necessary to obtain a target resonant frequency.

Inventors:
; ; ;
Issue Date:
Research Org.:
Kansas City Plant (KCP), Kansas City, MO (United States)
Sponsoring Org.:
USDOE National Nuclear Security Administration (NNSA)
OSTI Identifier:
2293842
Patent Number(s):
11811132
Application Number:
17/511,054
Assignee:
Honeywell Federal Manufacturing & Technologies, LLC (Kansas City, MO)
DOE Contract Number:  
NA0002839
Resource Type:
Patent
Resource Relation:
Patent File Date: 10/26/2021
Country of Publication:
United States
Language:
English

Citation Formats

Young, Barbara Diane, Sedlock, Steven James, Ledden, Kevin Christopher, and Elliot, Alan Ahlberg. Radio frequency tuning using a multichip module electrical interconnect structure. United States: N. p., 2023. Web.
Young, Barbara Diane, Sedlock, Steven James, Ledden, Kevin Christopher, & Elliot, Alan Ahlberg. Radio frequency tuning using a multichip module electrical interconnect structure. United States.
Young, Barbara Diane, Sedlock, Steven James, Ledden, Kevin Christopher, and Elliot, Alan Ahlberg. Tue . "Radio frequency tuning using a multichip module electrical interconnect structure". United States. https://www.osti.gov/servlets/purl/2293842.
@article{osti_2293842,
title = {Radio frequency tuning using a multichip module electrical interconnect structure},
author = {Young, Barbara Diane and Sedlock, Steven James and Ledden, Kevin Christopher and Elliot, Alan Ahlberg},
abstractNote = {A method for tuning a resonant frequency of wireless communication circuitry on a multichip module including a plurality of chips includes applying an electrical insulator to an upper surface of the multichip module; creating a plurality of openings in the electrical insulator, each opening being positioned at a successive one of the bond pads to be electrically connected to create a plurality of exposed bond pads; applying metal to each exposed bond pad to form a successive one of a plurality of interconnect bases; removing a portion of the layer of photoresist to create a plurality of bridge supports, each bridge support positioned between a successive pair of interconnect bases; applying metal to each bridge support and associated interconnect bases to form a successive one of the interconnect traces; removing the bridge supports; and disconnecting one or more of the interconnect traces as necessary to obtain a target resonant frequency.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2023},
month = {11}
}

Works referenced in this record:

IR Assisted Fan-out Wafer Level Packaging Using Silicon Handler
patent-application, March 2020


Integrated fan-out structure and method of forming
patent, July 2019


On-chip RF shields with front side redistribution lines
patent, May 2012