Electrical interconnect structure using metal bridges to interconnect die
Abstract
A multichip module comprises a carrier, a plurality of chips, an electrical insulating layer, and an electrical interconnect structure. The carrier includes a bottom wall and four side walls defining an internal cavity. The chips are positioned in the internal cavity, with each chip including a plurality of bond pads. The electrical insulating layer is formed from electrically insulating material and is positioned on an upper surface of the carrier and the chips. The electrical interconnect structure includes a plurality of interconnect traces, with each interconnect trace formed from electrically conductive material and electrically connected to a first bond pad on a first chip and a second bond pad on a second chip. Each interconnect trace includes a bridge having a segment that is spaced apart from, and positioned above, the electrical insulating layer.
- Inventors:
- Issue Date:
- Research Org.:
- Kansas City Plant (KCP), Kansas City, MO (United States)
- Sponsoring Org.:
- USDOE National Nuclear Security Administration (NNSA)
- OSTI Identifier:
- 2293839
- Patent Number(s):
- 11810895
- Application Number:
- 17/501,043
- Assignee:
- Honeywell Federal Manufacturing & Technologies, LLC (Kansas City, MO)
- DOE Contract Number:
- NA0002839
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 10/14/2021
- Country of Publication:
- United States
- Language:
- English
Citation Formats
Young, Barbara Diane, Sedlock, Steven James, Ledden, Kevin Christopher, and Elliot, Alan Ahlberg. Electrical interconnect structure using metal bridges to interconnect die. United States: N. p., 2023.
Web.
Young, Barbara Diane, Sedlock, Steven James, Ledden, Kevin Christopher, & Elliot, Alan Ahlberg. Electrical interconnect structure using metal bridges to interconnect die. United States.
Young, Barbara Diane, Sedlock, Steven James, Ledden, Kevin Christopher, and Elliot, Alan Ahlberg. Tue .
"Electrical interconnect structure using metal bridges to interconnect die". United States. https://www.osti.gov/servlets/purl/2293839.
@article{osti_2293839,
title = {Electrical interconnect structure using metal bridges to interconnect die},
author = {Young, Barbara Diane and Sedlock, Steven James and Ledden, Kevin Christopher and Elliot, Alan Ahlberg},
abstractNote = {A multichip module comprises a carrier, a plurality of chips, an electrical insulating layer, and an electrical interconnect structure. The carrier includes a bottom wall and four side walls defining an internal cavity. The chips are positioned in the internal cavity, with each chip including a plurality of bond pads. The electrical insulating layer is formed from electrically insulating material and is positioned on an upper surface of the carrier and the chips. The electrical interconnect structure includes a plurality of interconnect traces, with each interconnect trace formed from electrically conductive material and electrically connected to a first bond pad on a first chip and a second bond pad on a second chip. Each interconnect trace includes a bridge having a segment that is spaced apart from, and positioned above, the electrical insulating layer.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2023},
month = {11}
}
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