Dopant for improving casting and electroplating performance
Abstract
Systems, methods, components, and parts are provided for improving casting and electroplating performance of a plated cast part by doping a semiconductor material with an electrically active dopant before mixing the semiconductor material into a base material. The doped semiconductor material improves the castability of the base material and has an improved electrical conductivity which is closer to that of the base material such that a consistency of a subsequent plating on the part is improved.
- Inventors:
- Issue Date:
- Research Org.:
- Kansas City Plant (KCP), Kansas City, MO (United States)
- Sponsoring Org.:
- USDOE National Nuclear Security Administration (NNSA)
- OSTI Identifier:
- 2293814
- Patent Number(s):
- 11806964
- Application Number:
- 17/462,273
- Assignee:
- Honeywell Federal Manufacturing & Technologies, LLC (Kansas City, MO)
- DOE Contract Number:
- NA0002839
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 08/31/2021
- Country of Publication:
- United States
- Language:
- English
Citation Formats
Young, Barbara Diane, and Sedlock, Steven James. Dopant for improving casting and electroplating performance. United States: N. p., 2023.
Web.
Young, Barbara Diane, & Sedlock, Steven James. Dopant for improving casting and electroplating performance. United States.
Young, Barbara Diane, and Sedlock, Steven James. Tue .
"Dopant for improving casting and electroplating performance". United States. https://www.osti.gov/servlets/purl/2293814.
@article{osti_2293814,
title = {Dopant for improving casting and electroplating performance},
author = {Young, Barbara Diane and Sedlock, Steven James},
abstractNote = {Systems, methods, components, and parts are provided for improving casting and electroplating performance of a plated cast part by doping a semiconductor material with an electrically active dopant before mixing the semiconductor material into a base material. The doped semiconductor material improves the castability of the base material and has an improved electrical conductivity which is closer to that of the base material such that a consistency of a subsequent plating on the part is improved.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2023},
month = {11}
}
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