Method of chemical doping that uses CMOS-compatible processes
Abstract
A method of Atomic Precision Advanced Manufacturing (APAM) is provided, in which a substrate is doped from a dopant precursor gas. The method involves covering a surface of the substrate with a hard mask, selectively removing material from the hard mask such that selected areas of the substrate surface are laid bare, exposing the laid-bare areas to the dopant precursor gas, and heating the substrate so as to incorporate dopant from the dopant precursor gas into the substrate surface.
- Inventors:
- Issue Date:
- Research Org.:
- Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
- Sponsoring Org.:
- USDOE National Nuclear Security Administration (NNSA)
- OSTI Identifier:
- 2293772
- Patent Number(s):
- 11798808
- Application Number:
- 17/360,284
- Assignee:
- National Technology & Engineering Solutions of Sandia, LLC (Albuquerque, NM)
- DOE Contract Number:
- NA0003525
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 06/28/2021
- Country of Publication:
- United States
- Language:
- English
Citation Formats
Misra, Shashank, Ward, Daniel Robert, Campbell, DeAnna Marie, Lu, Tzu-Ming, Schmucker, Scott William, Anderson, Evan Michael, Leenheer, Andrew Jay, and Ivie, Jeffrey Andrew. Method of chemical doping that uses CMOS-compatible processes. United States: N. p., 2023.
Web.
Misra, Shashank, Ward, Daniel Robert, Campbell, DeAnna Marie, Lu, Tzu-Ming, Schmucker, Scott William, Anderson, Evan Michael, Leenheer, Andrew Jay, & Ivie, Jeffrey Andrew. Method of chemical doping that uses CMOS-compatible processes. United States.
Misra, Shashank, Ward, Daniel Robert, Campbell, DeAnna Marie, Lu, Tzu-Ming, Schmucker, Scott William, Anderson, Evan Michael, Leenheer, Andrew Jay, and Ivie, Jeffrey Andrew. Tue .
"Method of chemical doping that uses CMOS-compatible processes". United States. https://www.osti.gov/servlets/purl/2293772.
@article{osti_2293772,
title = {Method of chemical doping that uses CMOS-compatible processes},
author = {Misra, Shashank and Ward, Daniel Robert and Campbell, DeAnna Marie and Lu, Tzu-Ming and Schmucker, Scott William and Anderson, Evan Michael and Leenheer, Andrew Jay and Ivie, Jeffrey Andrew},
abstractNote = {A method of Atomic Precision Advanced Manufacturing (APAM) is provided, in which a substrate is doped from a dopant precursor gas. The method involves covering a surface of the substrate with a hard mask, selectively removing material from the hard mask such that selected areas of the substrate surface are laid bare, exposing the laid-bare areas to the dopant precursor gas, and heating the substrate so as to incorporate dopant from the dopant precursor gas into the substrate surface.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2023},
month = {10}
}
Works referenced in this record:
Photothermal alternative to device fabrication using atomic precision advanced manufacturing techniques
conference, March 2020
- Katzenmeyer, Aaron; Dmitrovic, Sanja; Baczewski, Andrew
- Novel Patterning Technologies for Semiconductors, MEMS/NEMS and MOEMS 2020
Spin read-out in atomic qubits in an all-epitaxial three-dimensional transistor
journal, January 2019
- Koch, Matthias; Keizer, Joris G.; Pakkiam, Prasanna
- Nature Nanotechnology, Vol. 14, Issue 2
All-optical lithography process for contacting nanometer precision donor devices
journal, November 2017
- Ward, D. R.; Marshall, M. T.; Campbell, D. M.
- Applied Physics Letters, Vol. 111, Issue 19
Atomically Precise Placement of Single Dopants in Si
journal, September 2003
- Schofield, S. R.; Curson, N. J.; Simmons, M. Y.
- Physical Review Letters, Vol. 91, Issue 13
Atomic Precision Advanced Manufacturing for Digital Electronics
journal, February 2020
- Ward, Daniel R.; Schmucker, Scott W.; Anderson, Evan M.
- EDFA Technical Articles, Vol. 22, Issue 1
Single-Shot Spin Readout in Semiconductors Near the Shot-Noise Sensitivity Limit
journal, October 2019
- Keith, D.; House, M. G.; Donnelly, M. B.
- Physical Review X, Vol. 9, Issue 4
A two-qubit gate between phosphorus donor electrons in silicon
journal, July 2019
- He, Y.; Gorman, S. K.; Keith, D.
- Nature, Vol. 571, Issue 7765
A single-atom transistor
journal, February 2012
- Fuechsle, Martin; Miwa, Jill A.; Mahapatra, Suddhasatta
- Nature Nanotechnology, Vol. 7, Issue 4
CMOS Compatible Atomic-Precision Donor Devices
journal, May 2020
- Ward, Daniel R.; Campbell, DeAnna M.; England, Troy
- ECS Meeting Abstracts, Vol. MA2020-01, Issue 24
Low-Temperature Silicon Epitaxy for Atomic Precision Devices
journal, October 2019
- Anderson, Evan M.; Katzenmeyer, Aaron M.; Luk, Ting S.
- ECS Transactions, Vol. 93, Issue 1
Method of forming contact plugs
patent, January 1999
- Juengling, Werner; Prall, Kirk D.; Haller, Gordon A.
- US Patent Document 5,858,865
Semiconductor devices and methods for forming the same
patent, December 2016
- Lee, Chia-Hao; Hung, Pei-Heng; Liao, Chih-Cherng
- US Patent Document 9,525,045
Measurement of phosphorus segregation in silicon at the atomic scale using scanning tunneling microscopy
journal, August 2004
- Oberbeck, L.; Curson, N. J.; Hallam, T.
- Applied Physics Letters, Vol. 85, Issue 8
CMOS platform for atomic-scale device fabrication
journal, August 2018
- Škereň, Tomáš; Pascher, Nikola; Garnier, Arnaud
- Nanotechnology, Vol. 29, Issue 43
Atomic-Scale Desorption Through Electronic and Vibrational Excitation Mechanisms
journal, June 1995
- Shen, T. -C.; Wang, C.; Abeln, G. C.
- Science, Vol. 268, Issue 5217