Copper alloys for interconnectors and methods for making the same
Abstract
Metallic alloy interconnects (which can comprise copper) with low electrical resistivity and methods for making the same are disclosed. The electrical resistivity of thin film copper alloys was reduced by 36% with niobium solute and by 51% with iron solute compared to pure copper counterpart in dilute solute regimes (0-1.5 atomic %). The fabrication method is operated at room temperature, and does not require a high temperature annealing step.
- Inventors:
- Issue Date:
- Research Org.:
- Univ. of Pennsylvania, Philadelphia, PA (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 2293685
- Patent Number(s):
- 11776893
- Application Number:
- 16/624,045
- Assignee:
- The Trustees of the University of Pennsylvania (Philadelphia, PA)
- DOE Contract Number:
- SC0008135
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 06/19/2018
- Country of Publication:
- United States
- Language:
- English
Citation Formats
Gianola, Daniel S., and Kim, Gyuseok. Copper alloys for interconnectors and methods for making the same. United States: N. p., 2023.
Web.
Gianola, Daniel S., & Kim, Gyuseok. Copper alloys for interconnectors and methods for making the same. United States.
Gianola, Daniel S., and Kim, Gyuseok. Tue .
"Copper alloys for interconnectors and methods for making the same". United States. https://www.osti.gov/servlets/purl/2293685.
@article{osti_2293685,
title = {Copper alloys for interconnectors and methods for making the same},
author = {Gianola, Daniel S. and Kim, Gyuseok},
abstractNote = {Metallic alloy interconnects (which can comprise copper) with low electrical resistivity and methods for making the same are disclosed. The electrical resistivity of thin film copper alloys was reduced by 36% with niobium solute and by 51% with iron solute compared to pure copper counterpart in dilute solute regimes (0-1.5 atomic %). The fabrication method is operated at room temperature, and does not require a high temperature annealing step.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2023},
month = {10}
}
Save to My Library
You must Sign In or Create an Account in order to save documents to your library.
Works referenced in this record:
Design of Stable Nanocrystalline Alloys
journal, August 2012
- Chookajorn, T.; Murdoch, H. A.; Schuh, C. A.
- Science, Vol. 337, Issue 6097
Electrical resistivity of Cu and Nb thin films
journal, March 1998
- Fenn, M.; Akuetey, G.; Donovan, P. E.
- Journal of Physics: Condensed Matter, Vol. 10, Issue 8
Interplay between grain boundary segregation and electrical resistivity in dilute nanocrystalline Cu alloys
journal, October 2016
- Kim, Gyuseok; Chai, Xuzhao; Yu, Le
- Scripta Materialia, Vol. 123
Effect of ion irradiation on tensile ductility, strength and fictive temperature in metallic glass nanowires
journal, August 2014
- Magagnosc, D. J.; Kumar, G.; Schroers, J.
- Acta Materialia, Vol. 74
Stable nanocrystalline metal alloy coatings with ultra-low wear
patent, September 2020
- Argibay, Nicolas; Chandross, Michael E.; Adams, David P.
- US Patent Document 10,763,000
Pulsed electrodeposition of nanocrystalline Cu–Ni alloy films and evaluation of their characteristic properties
journal, July 2006
- Baskaran, I.; Sankara Narayanan, T. S. N.; Stephen, A.
- Materials Letters, Vol. 60, Issue 16
MOSFET integrated circuit having doped conductive interconnects and methods for its manufacture
patent, November 2013
- Witt, Christian
- US Patent Document 8,580,665
Resonant Kondo scattering in Cu(Fe) thin film
journal, March 1996
- Apostolopoulos, G.; Rocofyllou, E.; Papastaikoudis, C.
- Journal of Physics: Condensed Matter, Vol. 8, Issue 10
Method of making copper alloys for chip and package interconnections
patent, July 2000
- Andricacos, Panayotis; Deligianni, Hariklia; Harper, James M. E.
- US Patent Document 6,090,710
Indium-free, highly transparent, flexible Cu2O/Cu/Cu2O mesh electrodes for flexible touch screen panels
journal, November 2015
- Kim, Dong-Ju; Kim, Hyo-Joong; Seo, Ki-Won
- Scientific Reports, Vol. 5, Issue 1
Copper alloy metallurgies for VLSI interconnection structures
patent, July 1992
- Harper, James M. E.; Holloway, Karen L.; Kwok, Thomas Yu-Kiu
- US Patent Document 5,130,274
“Bulk” Nanocrystalline Metals: Review of the Current State of the Art and Future Opportunities for Copper and Copper Alloys
journal, May 2014
- Tschopp, M. A.; Murdoch, H. A.; Kecskes, L. J.
- JOM, Vol. 66, Issue 6
Improved reliability of copper interconnects using alloying
conference, July 2010
- Gambino, Jeffrey P.
- 2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits
Influence of alloying elements on grain-growth in Zr(Fe) and Cu(Fe) thin-films under in situ ion-irradiation
journal, December 2008
- Kaoumi, D.; Motta, A. T.; Birtcher, R. C.
- Journal of Nuclear Materials, Vol. 382, Issue 2-3
Size-dependent resistivity of metallic wires in the mesoscopic range
journal, August 2002
- Steinhögl, Werner; Schindler, Günther; Steinlesberger, Gernot
- Physical Review B, Vol. 66, Issue 7
Method for segregating the alloying elements and reducing the residue resistivity of copper alloy layers
patent, October 2014
- Fu, Xinyu; Yu, Jick
- US Patent Document 8,852,674