Copper alloys for interconnectors and methods for making the same
Abstract
Metallic alloy interconnects (which can comprise copper) with low electrical resistivity and methods for making the same are disclosed. The electrical resistivity of thin film copper alloys was reduced by 36% with niobium solute and by 51% with iron solute compared to pure copper counterpart in dilute solute regimes (0-1.5 atomic %). The fabrication method is operated at room temperature, and does not require a high temperature annealing step.
- Inventors:
- Issue Date:
- Research Org.:
- Univ. of Pennsylvania, Philadelphia, PA (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 2293685
- Patent Number(s):
- 11776893
- Application Number:
- 16/624,045
- Assignee:
- The Trustees of the University of Pennsylvania (Philadelphia, PA)
- DOE Contract Number:
- SC0008135
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 06/19/2018
- Country of Publication:
- United States
- Language:
- English
Citation Formats
Gianola, Daniel S., and Kim, Gyuseok. Copper alloys for interconnectors and methods for making the same. United States: N. p., 2023.
Web.
Gianola, Daniel S., & Kim, Gyuseok. Copper alloys for interconnectors and methods for making the same. United States.
Gianola, Daniel S., and Kim, Gyuseok. Tue .
"Copper alloys for interconnectors and methods for making the same". United States. https://www.osti.gov/servlets/purl/2293685.
@article{osti_2293685,
title = {Copper alloys for interconnectors and methods for making the same},
author = {Gianola, Daniel S. and Kim, Gyuseok},
abstractNote = {Metallic alloy interconnects (which can comprise copper) with low electrical resistivity and methods for making the same are disclosed. The electrical resistivity of thin film copper alloys was reduced by 36% with niobium solute and by 51% with iron solute compared to pure copper counterpart in dilute solute regimes (0-1.5 atomic %). The fabrication method is operated at room temperature, and does not require a high temperature annealing step.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Oct 03 00:00:00 EDT 2023},
month = {Tue Oct 03 00:00:00 EDT 2023}
}
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