Stability of refractory materials in high temperature steam
Abstract
The present invention relates, in part, to a discovery of a method for using atomic layer deposition (ALD) to improve the stability of refractory materials in high temperature steam, and compositions produced by the method.
- Inventors:
- Issue Date:
- Research Org.:
- Univ. of Colorado, Denver, CO (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 2222324
- Patent Number(s):
- 11753717
- Application Number:
- 16/348,980
- Assignee:
- The Regents of the University of Colorado (Denver, CO)
- Patent Classifications (CPCs):
-
B - PERFORMING OPERATIONS B32 - LAYERED PRODUCTS B32B - LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
B - PERFORMING OPERATIONS B81 - MICROSTRUCTURAL TECHNOLOGY B81B - MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- DOE Contract Number:
- EE0006671
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 11/10/2017
- Country of Publication:
- United States
- Language:
- English
Citation Formats
Weimer, Alan W., Hoskins, Amanda, and Musgrove, Charles. Stability of refractory materials in high temperature steam. United States: N. p., 2023.
Web.
Weimer, Alan W., Hoskins, Amanda, & Musgrove, Charles. Stability of refractory materials in high temperature steam. United States.
Weimer, Alan W., Hoskins, Amanda, and Musgrove, Charles. Tue .
"Stability of refractory materials in high temperature steam". United States. https://www.osti.gov/servlets/purl/2222324.
@article{osti_2222324,
title = {Stability of refractory materials in high temperature steam},
author = {Weimer, Alan W. and Hoskins, Amanda and Musgrove, Charles},
abstractNote = {The present invention relates, in part, to a discovery of a method for using atomic layer deposition (ALD) to improve the stability of refractory materials in high temperature steam, and compositions produced by the method.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2023},
month = {9}
}
Works referenced in this record:
Trench Isolation Structures for Integrated Circuits
patent-application, December 2007
- Raaijmakers, Ivo; Soininen, Pekka T.; Granneman, Ernst H. A.
- US Patent Application 11/844227; 20070287261
Ultra-thin metal oxide and carbon-metal oxide films prepared by atomic layer deposition (ALD)
patent-application, August 2012
- Weimer, Alan; Liang, Xinhua; Li, Jianhua
- US Patent Application 13/319122; 20120201860
Encapsulation Barrier Stack
patent-application, November 2015
- Ramadas, Senthil Kumar; Shanmugavel, Saravan
- US Patent Application 14/436709; 20150314941
Trench Isolation for Integrated Circuit
patent-application, January 2003
- Raaijmakers, Ivo; Soininen, Pekka T.; Granneman, Ernst H. A.
- US Patent Application 09/887199; 20030015764
Nanocoated Primary Particles and Method for their Manufacture
patent-application, June 2004
- George, Steven M.; Ferguson, Josh D.; Weimer, Alan W.
- US Patent Application 10/731639; 20040121073
Semiconductor substrates of high reliability ceramic metal composites
patent, April 2000
- Sakuraba, Masami; Kimura, Masami; Nakamura, Junji
- US Patent Document 6,054,762