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Title: Stability of refractory materials in high temperature steam

Abstract

The present invention relates, in part, to a discovery of a method for using atomic layer deposition (ALD) to improve the stability of refractory materials in high temperature steam, and compositions produced by the method.

Inventors:
; ;
Issue Date:
Research Org.:
Univ. of Colorado, Denver, CO (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
2222324
Patent Number(s):
11753717
Application Number:
16/348,980
Assignee:
The Regents of the University of Colorado (Denver, CO)
Patent Classifications (CPCs):
B - PERFORMING OPERATIONS B32 - LAYERED PRODUCTS B32B - LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
B - PERFORMING OPERATIONS B81 - MICROSTRUCTURAL TECHNOLOGY B81B - MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
DOE Contract Number:  
EE0006671
Resource Type:
Patent
Resource Relation:
Patent File Date: 11/10/2017
Country of Publication:
United States
Language:
English

Citation Formats

Weimer, Alan W., Hoskins, Amanda, and Musgrove, Charles. Stability of refractory materials in high temperature steam. United States: N. p., 2023. Web.
Weimer, Alan W., Hoskins, Amanda, & Musgrove, Charles. Stability of refractory materials in high temperature steam. United States.
Weimer, Alan W., Hoskins, Amanda, and Musgrove, Charles. Tue . "Stability of refractory materials in high temperature steam". United States. https://www.osti.gov/servlets/purl/2222324.
@article{osti_2222324,
title = {Stability of refractory materials in high temperature steam},
author = {Weimer, Alan W. and Hoskins, Amanda and Musgrove, Charles},
abstractNote = {The present invention relates, in part, to a discovery of a method for using atomic layer deposition (ALD) to improve the stability of refractory materials in high temperature steam, and compositions produced by the method.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2023},
month = {9}
}

Works referenced in this record:

Trench Isolation Structures for Integrated Circuits
patent-application, December 2007


Ultra-thin metal oxide and carbon-metal oxide films prepared by atomic layer deposition (ALD)
patent-application, August 2012


Encapsulation Barrier Stack
patent-application, November 2015


Trench Isolation for Integrated Circuit
patent-application, January 2003


Nanocoated Primary Particles and Method for their Manufacture
patent-application, June 2004


Semiconductor substrates of high reliability ceramic metal composites
patent, April 2000