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Title: Laser drilling and machining enhancement using gated CW and short pulsed lasers

Abstract

The present disclosure relates to a laser system for processing a material. The system may make use of a laser configured to intermittently generate a first laser pulse of a first duration and a first average power, at a spot on a surface of the material being processed, and a second laser pulse having a second duration and a second peak power. The second duration may be shorter than the first duration by a factor of at least 100, and directed at the spot. The second laser pulse is generated after the first laser pulse is generated. The first laser pulse is used to heat the spot on the surface of the material, while the second laser pulse induces a melt motion and material ejection of molten material from the melt pool.

Inventors:
; ; ; ; ; ;
Issue Date:
Research Org.:
Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
2222024
Patent Number(s):
11712750
Application Number:
17/040,155
Assignee:
Lawrence Livermore National Security, LLC (Livermore, CA)
DOE Contract Number:  
AC52-07NA27344
Resource Type:
Patent
Resource Relation:
Patent File Date: 03/22/2019
Country of Publication:
United States
Language:
English

Citation Formats

Ly, Sonny S., Bude, Jeffrey D., Guss, Gabriel Mark, Keller, Wesley John, Negres, Raluca A., Rubenchik, Alexander M., and Shen, Nan. Laser drilling and machining enhancement using gated CW and short pulsed lasers. United States: N. p., 2023. Web.
Ly, Sonny S., Bude, Jeffrey D., Guss, Gabriel Mark, Keller, Wesley John, Negres, Raluca A., Rubenchik, Alexander M., & Shen, Nan. Laser drilling and machining enhancement using gated CW and short pulsed lasers. United States.
Ly, Sonny S., Bude, Jeffrey D., Guss, Gabriel Mark, Keller, Wesley John, Negres, Raluca A., Rubenchik, Alexander M., and Shen, Nan. Tue . "Laser drilling and machining enhancement using gated CW and short pulsed lasers". United States. https://www.osti.gov/servlets/purl/2222024.
@article{osti_2222024,
title = {Laser drilling and machining enhancement using gated CW and short pulsed lasers},
author = {Ly, Sonny S. and Bude, Jeffrey D. and Guss, Gabriel Mark and Keller, Wesley John and Negres, Raluca A. and Rubenchik, Alexander M. and Shen, Nan},
abstractNote = {The present disclosure relates to a laser system for processing a material. The system may make use of a laser configured to intermittently generate a first laser pulse of a first duration and a first average power, at a spot on a surface of the material being processed, and a second laser pulse having a second duration and a second peak power. The second duration may be shorter than the first duration by a factor of at least 100, and directed at the spot. The second laser pulse is generated after the first laser pulse is generated. The first laser pulse is used to heat the spot on the surface of the material, while the second laser pulse induces a melt motion and material ejection of molten material from the melt pool.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Aug 01 00:00:00 EDT 2023},
month = {Tue Aug 01 00:00:00 EDT 2023}
}

Works referenced in this record:

Process for laser machining and surface treatment
patent, October 2004


Enhanced drilling using a dual-pulse Nd:YAG laser
journal, July 2001


Method and device for stand-off laser drilling and cutting
patent, September 1989


Laser Systems and Methods Using Triangular-Shaped Tailored Laser Pulses for Selected Target Classes
patent-application, November 2010


Systems and Processes that Singulate Materials
patent-application, March 2013


Laser-Based Modification of Transparent Materials
patent-application, November 2016


Double-pulse machining as a technique for the enhancement of material removal rates in laser machining of metals
journal, August 2005