Laser drilling and machining enhancement using gated CW and short pulsed lasers
Abstract
The present disclosure relates to a laser system for processing a material. The system may make use of a laser configured to intermittently generate a first laser pulse of a first duration and a first average power, at a spot on a surface of the material being processed, and a second laser pulse having a second duration and a second peak power. The second duration may be shorter than the first duration by a factor of at least 100, and directed at the spot. The second laser pulse is generated after the first laser pulse is generated. The first laser pulse is used to heat the spot on the surface of the material, while the second laser pulse induces a melt motion and material ejection of molten material from the melt pool.
- Inventors:
- Issue Date:
- Research Org.:
- Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 2222024
- Patent Number(s):
- 11712750
- Application Number:
- 17/040,155
- Assignee:
- Lawrence Livermore National Security, LLC (Livermore, CA)
- DOE Contract Number:
- AC52-07NA27344
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 03/22/2019
- Country of Publication:
- United States
- Language:
- English
Citation Formats
Ly, Sonny S., Bude, Jeffrey D., Guss, Gabriel Mark, Keller, Wesley John, Negres, Raluca A., Rubenchik, Alexander M., and Shen, Nan. Laser drilling and machining enhancement using gated CW and short pulsed lasers. United States: N. p., 2023.
Web.
Ly, Sonny S., Bude, Jeffrey D., Guss, Gabriel Mark, Keller, Wesley John, Negres, Raluca A., Rubenchik, Alexander M., & Shen, Nan. Laser drilling and machining enhancement using gated CW and short pulsed lasers. United States.
Ly, Sonny S., Bude, Jeffrey D., Guss, Gabriel Mark, Keller, Wesley John, Negres, Raluca A., Rubenchik, Alexander M., and Shen, Nan. Tue .
"Laser drilling and machining enhancement using gated CW and short pulsed lasers". United States. https://www.osti.gov/servlets/purl/2222024.
@article{osti_2222024,
title = {Laser drilling and machining enhancement using gated CW and short pulsed lasers},
author = {Ly, Sonny S. and Bude, Jeffrey D. and Guss, Gabriel Mark and Keller, Wesley John and Negres, Raluca A. and Rubenchik, Alexander M. and Shen, Nan},
abstractNote = {The present disclosure relates to a laser system for processing a material. The system may make use of a laser configured to intermittently generate a first laser pulse of a first duration and a first average power, at a spot on a surface of the material being processed, and a second laser pulse having a second duration and a second peak power. The second duration may be shorter than the first duration by a factor of at least 100, and directed at the spot. The second laser pulse is generated after the first laser pulse is generated. The first laser pulse is used to heat the spot on the surface of the material, while the second laser pulse induces a melt motion and material ejection of molten material from the melt pool.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Tue Aug 01 00:00:00 EDT 2023},
month = {Tue Aug 01 00:00:00 EDT 2023}
}
Works referenced in this record:
Process for laser machining and surface treatment
patent, October 2004
- Neil, George R.; Shinn, Michelle D.
- US Patent Document 6,809,291
Enhanced drilling using a dual-pulse Nd:YAG laser
journal, July 2001
- Lehane, C.; Kwok, H. S.
- Applied Physics A Materials Science & Processing, Vol. 73, Issue 1
Method and apparatus for laser cutting and drilling of semiconductor materials and glass
patent, February 2007
- Semak, Vladimir
- US Patent Document 7,173,212
UV-Visible Laser System Having Ultrashort Highpower and/or High-Energy Pulses
patent-application, May 2017
- Courjaud, Antoine
- US Patent Application 15/322737; 20170141530
Method and device for stand-off laser drilling and cutting
patent, September 1989
- Copley, John A.; Kwok, Hoi Sing; Domankevitz, Yacov
- US Patent Document 4,870,244
Laser Systems and Methods Using Triangular-Shaped Tailored Laser Pulses for Selected Target Classes
patent-application, November 2010
- Cho, Bong H.; Pugh, Brian L.; Hooper, Andrew
- US Patent Application 12/753659; 20100276405
Systems and Processes that Singulate Materials
patent-application, March 2013
- Mielke, Michael; Srinivas, Ramanujapuram A.; Booth, Tim
- US Patent Application 13/239323; 20130068736
Laser-Based Modification of Transparent Materials
patent-application, November 2016
- Ota, Michiharu; Arai, Alan Y.; Liu, Zhenlin
- US Patent Application 15/208374; 20160318122
Femtosecond Laser Processing System with Process Parameters Controls and Feedback
patent-application, August 2015
- Harter, Donald J.
- US Patent Application 14/837619; 20150372445
Double-pulse machining as a technique for the enhancement of material removal rates in laser machining of metals
journal, August 2005
- Forsman, A. C.; Banks, P. S.; Perry, M. D.
- Journal of Applied Physics, Vol. 98, Issue 3