Hyperelastic binder for printed, stretchable electronics

Wang, Joseph; Kumar, Rajan; Meng, Ying Shirley; Shin, Jae Wook; Yin, Lu

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Title: Hyperelastic binder for printed, stretchable electronics

Abstract

Disclosed are compositions, devices, systems and fabrication methods for stretchable composite materials and stretchable electronics devices. In some aspects, an elastic composite material for a stretchable electronics device includes a first material having a particular electrical, mechanical or optical property; and a multi-block copolymer configured to form a hyperelastic binder that creates contact between the first material and the multi-block copolymer, in which the elastic composite material is structured to stretch at least 500% in at least one direction of the material and to exhibit the particular electrical, mechanical or optical property imparted from the first material. In some aspects, the stretchable electronics device includes a stretchable battery, biofuel cell, sensor, supercapacitor or other device able to be mounted to skin, clothing or other surface of a user or object.

Inventors:: Wang, Joseph; Kumar, Rajan; Meng, Ying Shirley; Shin, Jae Wook; Yin, Lu

Issue Date:: 2023-06-13

Research Org.:: Univ. of California, La Jolla, CA (United States)

Sponsoring Org.:: USDOE Advanced Research Projects Agency - Energy (ARPA-E); National Science Foundation (NSF)

OSTI Identifier:: 1998492

Patent Number(s):: 11678436

Application Number:: 17/500,931

Assignee:: The Regents of the University of California (Oakland, CA)

DOE Contract Number:: AR0000535; ECCS-1542148

Resource Type:: Patent

Resource Relation:: Patent File Date: 10/13/2021

Country of Publication:: United States

Language:: English

Citation Formats


                    Wang, Joseph, Kumar, Rajan, Meng, Ying Shirley, Shin, Jae Wook, and Yin, Lu. Hyperelastic binder for printed, stretchable electronics.  United States: N. p., 2023. 
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                    Wang, Joseph, Kumar, Rajan, Meng, Ying Shirley, Shin, Jae Wook, & Yin, Lu. Hyperelastic binder for printed, stretchable electronics.  United States.

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                    Wang, Joseph, Kumar, Rajan, Meng, Ying Shirley, Shin, Jae Wook, and Yin, Lu. Tue .  
        "Hyperelastic binder for printed, stretchable electronics".  United States.  https://www.osti.gov/servlets/purl/1998492.

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@article{osti_1998492,

  title        = {Hyperelastic binder for printed, stretchable electronics},

  author       = {Wang, Joseph and Kumar, Rajan and Meng, Ying Shirley and Shin, Jae Wook and Yin, Lu},

  abstractNote = {Disclosed are compositions, devices, systems and fabrication methods for stretchable composite materials and stretchable electronics devices. In some aspects, an elastic composite material for a stretchable electronics device includes a first material having a particular electrical, mechanical or optical property; and a multi-block copolymer configured to form a hyperelastic binder that creates contact between the first material and the multi-block copolymer, in which the elastic composite material is structured to stretch at least 500% in at least one direction of the material and to exhibit the particular electrical, mechanical or optical property imparted from the first material. In some aspects, the stretchable electronics device includes a stretchable battery, biofuel cell, sensor, supercapacitor or other device able to be mounted to skin, clothing or other surface of a user or object.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {2023},

  month        = {6}

}

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