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Title: Evaporator stacks and electronic assemblies

Abstract

Provided is an evaporator stack. The evaporator stack may be used in power-dense electronic assemblies. The evaporator stack includes a lower floor including at least one mounded portion, and an enclosure surrounding the lower floor, wherein a height of the enclosure is greater than a height of the at least one mounded portion, the at least one mounded portion extending between two walls of the enclosure.

Inventors:
; ; ;
Issue Date:
Research Org.:
National Renewable Energy Laboratory (NREL), Golden, CO (United States); Deere & Company, Moline, IL (United States)
Sponsoring Org.:
USDOE
OSTI Identifier:
1987183
Patent Number(s):
11594468
Application Number:
17/018,255
Assignee:
Deere & Company (Moline, IL); Alliance for Sustainable Energy, LLC (Golden, CO)
Patent Classifications (CPCs):
F - MECHANICAL ENGINEERING F28 - HEAT EXCHANGE IN GENERAL F28D - HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
DOE Contract Number:  
AC36-08GO28308; CRADA 15-592
Resource Type:
Patent
Resource Relation:
Patent File Date: 09/11/2020
Country of Publication:
United States
Language:
English

Citation Formats

Roan, Thomas J., Singh, Brij N., Moreno, Gilberto, and Bennion, Kevin Scott. Evaporator stacks and electronic assemblies. United States: N. p., 2023. Web.
Roan, Thomas J., Singh, Brij N., Moreno, Gilberto, & Bennion, Kevin Scott. Evaporator stacks and electronic assemblies. United States.
Roan, Thomas J., Singh, Brij N., Moreno, Gilberto, and Bennion, Kevin Scott. Tue . "Evaporator stacks and electronic assemblies". United States. https://www.osti.gov/servlets/purl/1987183.
@article{osti_1987183,
title = {Evaporator stacks and electronic assemblies},
author = {Roan, Thomas J. and Singh, Brij N. and Moreno, Gilberto and Bennion, Kevin Scott},
abstractNote = {Provided is an evaporator stack. The evaporator stack may be used in power-dense electronic assemblies. The evaporator stack includes a lower floor including at least one mounded portion, and an enclosure surrounding the lower floor, wherein a height of the enclosure is greater than a height of the at least one mounded portion, the at least one mounded portion extending between two walls of the enclosure.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2023},
month = {2}
}

Works referenced in this record:

Heat dissipating device
patent, December 2018


Thermal Bus for Cabinets Housing High Power Electronics Equipment
patent-application, January 2003


Evaporatively Cooled Thermosiphon
patent-application, October 2007


Tunnel-phase change heat exchanger
patent, August 2003


Thermosiphon Systems for Electronic Devices
patent-application, February 2017


Electronic Assembly with Phase-Change Cooling of a Semiconductor Device
patent-application, September 2018


Thermosiphon for Laptop Computer
patent-application, October 2008


Two-phase heat exchanger for cooling electrical components
patent-application, May 2016