Method and apparatus for providing thermal wear leveling
Abstract
Exemplary embodiments provide thermal wear spreading among a plurality of thermal die regions in an integrated circuit or among dies by using die region wear-out data that represents a cumulative amount of time each of a number of thermal die regions in one or more dies has spent at a particular temperature level. In one example, die region wear-out data is stored in persistent memory and is accrued over a life of each respective thermal region so that a long term monitoring of temperature levels in the various die regions is used to spread thermal wear among the thermal die regions. In one example, spreading thermal wear is done by controlling task execution such as thread execution among one or more processing cores, dies and/or data access operations for a memory.
- Inventors:
- Issue Date:
- Research Org.:
- Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States); Advanced Micro Devices, Inc., Santa Clara, CA (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1987021
- Patent Number(s):
- 11551990
- Application Number:
- 15/674,607
- Assignee:
- Advanced Micro Devices, Inc. (Santa Clara, CA)
- DOE Contract Number:
- AC52-07NA27344; B620717
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 08/11/2017
- Country of Publication:
- United States
- Language:
- English
Citation Formats
Roberts, David A., Sadowski, Greg, and Raasch, Steven. Method and apparatus for providing thermal wear leveling. United States: N. p., 2023.
Web.
Roberts, David A., Sadowski, Greg, & Raasch, Steven. Method and apparatus for providing thermal wear leveling. United States.
Roberts, David A., Sadowski, Greg, and Raasch, Steven. Tue .
"Method and apparatus for providing thermal wear leveling". United States. https://www.osti.gov/servlets/purl/1987021.
@article{osti_1987021,
title = {Method and apparatus for providing thermal wear leveling},
author = {Roberts, David A. and Sadowski, Greg and Raasch, Steven},
abstractNote = {Exemplary embodiments provide thermal wear spreading among a plurality of thermal die regions in an integrated circuit or among dies by using die region wear-out data that represents a cumulative amount of time each of a number of thermal die regions in one or more dies has spent at a particular temperature level. In one example, die region wear-out data is stored in persistent memory and is accrued over a life of each respective thermal region so that a long term monitoring of temperature levels in the various die regions is used to spread thermal wear among the thermal die regions. In one example, spreading thermal wear is done by controlling task execution such as thread execution among one or more processing cores, dies and/or data access operations for a memory.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2023},
month = {1}
}
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