Functionally graded thermal vias for inductor winding heat flow control
Abstract
Embodiments of the disclosure relate to apparatuses for enhanced thermal management of an inductor assembly using functionally-graded thermal vias for heat flow control in the windings of the inductor. In one embodiment, a PCB for an inductor assembly includes a top surface and a bottom surface. Two or more electrically-conductive layers are embedded within the PCB and stacked vertically between the top surface and the bottom surface. The two or more electrically-conductive layers are electrically connected to form an inductor winding. A plurality of thermal vias thermally connects each of the two or more electrically-conductive layers to a cold plate thermally connected to the bottom surface. A number of thermal vias thermally connecting each electrically-conductive layer to the cold plate is directly proportional to a predetermined rate of heat dissipation from the electrically-conductive layer.
- Inventors:
- Issue Date:
- Research Org.:
- Toyota Motor Engineering & Manufacturing North America, Inc., Plano, TX (United States); Univ. of Colorado, Boulder, CO (United States)
- Sponsoring Org.:
- USDOE Advanced Research Projects Agency - Energy (ARPA-E)
- OSTI Identifier:
- 1986997
- Patent Number(s):
- 11545297
- Application Number:
- 16/692,653
- Assignee:
- Toyota Motor Engineering & Manufacturing North America, Inc. (Plano, TX); University of Colorado Boulder (Boulder, CO)
- DOE Contract Number:
- AR0000897
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 11/22/2019
- Country of Publication:
- United States
- Language:
- English
Citation Formats
Dede, Ercan, Gao, Yucheng, Sankaranarayanan, Vivek, Ghosh, Aritra, Erickson, Robert, and Maksimovic, Dragan. Functionally graded thermal vias for inductor winding heat flow control. United States: N. p., 2023.
Web.
Dede, Ercan, Gao, Yucheng, Sankaranarayanan, Vivek, Ghosh, Aritra, Erickson, Robert, & Maksimovic, Dragan. Functionally graded thermal vias for inductor winding heat flow control. United States.
Dede, Ercan, Gao, Yucheng, Sankaranarayanan, Vivek, Ghosh, Aritra, Erickson, Robert, and Maksimovic, Dragan. Tue .
"Functionally graded thermal vias for inductor winding heat flow control". United States. https://www.osti.gov/servlets/purl/1986997.
@article{osti_1986997,
title = {Functionally graded thermal vias for inductor winding heat flow control},
author = {Dede, Ercan and Gao, Yucheng and Sankaranarayanan, Vivek and Ghosh, Aritra and Erickson, Robert and Maksimovic, Dragan},
abstractNote = {Embodiments of the disclosure relate to apparatuses for enhanced thermal management of an inductor assembly using functionally-graded thermal vias for heat flow control in the windings of the inductor. In one embodiment, a PCB for an inductor assembly includes a top surface and a bottom surface. Two or more electrically-conductive layers are embedded within the PCB and stacked vertically between the top surface and the bottom surface. The two or more electrically-conductive layers are electrically connected to form an inductor winding. A plurality of thermal vias thermally connects each of the two or more electrically-conductive layers to a cold plate thermally connected to the bottom surface. A number of thermal vias thermally connecting each electrically-conductive layer to the cold plate is directly proportional to a predetermined rate of heat dissipation from the electrically-conductive layer.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2023},
month = {1}
}
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