Systems and methods for post-treatment of dry adhesive microstructures

Dadkhah Tehrani, Mohammad; Wettels, Nicholas

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Title: Systems and methods for post-treatment of dry adhesive microstructures

Abstract

Provided are systems and methods for the post-treatment of dry adhesive microstructures. The microstructures may be post-treated to comprise mushroom-like flaps at their tips to interface with the contact surface. In some aspects, a change in material composition of the microstructures in a dry adhesive may affect mechanical properties to enhance or diminish overall adhesive performance. For example, conductive additives can be added to the material to improve adhesive performance. In other aspects, microstructures comprising conductive material may allow for preload engagement sensing systems to be integrated into the microstructures.

Inventors:: Dadkhah Tehrani, Mohammad; Wettels, Nicholas

Issue Date:: 2022-12-27

Research Org.:: OnRobot A/S, Odense (Denmark)

Sponsoring Org.:: USDOE; National Aeronautics and Space Administration (NASA)

OSTI Identifier:: 1986975

Patent Number(s):: 11534926

Application Number:: 16/833,900

Assignee:: OnRobot A/S (Odense, DK)

DOE Contract Number:: NNX16CP19C

Resource Type:: Patent

Resource Relation:: Patent File Date: 03/30/2020

Country of Publication:: United States

Language:: English

Citation Formats


                    Dadkhah Tehrani, Mohammad, and Wettels, Nicholas. Systems and methods for post-treatment of dry adhesive microstructures.  United States: N. p., 2022. 
        Web.

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                    Dadkhah Tehrani, Mohammad, & Wettels, Nicholas. Systems and methods for post-treatment of dry adhesive microstructures.  United States.

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                    Dadkhah Tehrani, Mohammad, and Wettels, Nicholas. Tue .  
        "Systems and methods for post-treatment of dry adhesive microstructures".  United States.  https://www.osti.gov/servlets/purl/1986975.

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@article{osti_1986975,

  title        = {Systems and methods for post-treatment of dry adhesive microstructures},

  author       = {Dadkhah Tehrani, Mohammad and Wettels, Nicholas},

  abstractNote = {Provided are systems and methods for the post-treatment of dry adhesive microstructures. The microstructures may be post-treated to comprise mushroom-like flaps at their tips to interface with the contact surface. In some aspects, a change in material composition of the microstructures in a dry adhesive may affect mechanical properties to enhance or diminish overall adhesive performance. For example, conductive additives can be added to the material to improve adhesive performance. In other aspects, microstructures comprising conductive material may allow for preload engagement sensing systems to be integrated into the microstructures.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {2022},

  month        = {12}

}

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