Power module with organic layers

Gurpinar, Emre; Chowdhury, Md. Shajjad

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A - human necessities
A01 - agriculture
A21 - baking
A22 - butchering
A23 - foods or foodstuffs
A24 - tobacco
A41 - wearing apparel
A42 - headwear
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A44 - haberdashery
A45 - hand or travelling articles
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A47 - furniture
A61 - medical or veterinary science
A62 - life-saving
A63 - sports
A99 - subject matter not otherwise provided for in this section
B - performing operations
B01 - physical or chemical processes or apparatus in general
B02 - crushing, pulverising, or disintegrating
B03 - separation of solid materials using liquids or using pneumatic tables or jigs
B04 - centrifugal apparatus or machines for carrying-out physical or chemical processes
B05 - spraying or atomising in general
B06 - generating or transmitting mechanical vibrations in general
B07 - separating solids from solids
B08 - cleaning
B09 - disposal of solid waste
B21 - mechanical metal-working without essentially removing material
B22 - casting
B23 - machine tools
B24 - grinding
B25 - hand tools
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B27 - working or preserving wood or similar material
B28 - working cement, clay, or stone
B29 - working of plastics
B30 - presses
B31 - making articles of paper, cardboard or material worked in a manner analogous to paper
B32 - layered products
B33 - additive manufacturing technology
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B42 - bookbinding
B43 - writing or drawing implements
B44 - decorative arts
B60 - vehicles in general
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B62 - land vehicles for travelling otherwise than on rails
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B68 - saddlery
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C01 - inorganic chemistry
C02 - treatment of water, waste water, sewage, or sludge
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C22 - metallurgy
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C25 - electrolytic or electrophoretic processes
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D - textiles
D01 - natural or man-made threads or fibres
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D03 - weaving
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D05 - sewing
D06 - treatment of textiles or the like
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D10 - indexing scheme associated with sublasses of section d, relating to textiles
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Title: Power module with organic layers

Abstract

A power module is provided with reduced power and gate loop inductance. The power module may be configured in a multi-layer manner with one or more organic substrates.

Inventors:: Gurpinar, Emre; Chowdhury, Md. Shajjad

Issue Date:: 2022-12-13

Research Org.:: Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States)

Sponsoring Org.:: USDOE

OSTI Identifier:: 1986938

Patent Number(s):: 11527456

Application Number:: 17/085,123

Assignee:: UT-Battelle LLC (Oak Ridge, TN)

DOE Contract Number:: AC05-00OR22725

Resource Type:: Patent

Resource Relation:: Patent File Date: 10/30/2020

Country of Publication:: United States

Language:: English

Citation Formats


                    Gurpinar, Emre, and Chowdhury, Md. Shajjad. Power module with organic layers.  United States: N. p., 2022. 
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                    Gurpinar, Emre, & Chowdhury, Md. Shajjad. Power module with organic layers.  United States.

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                    Gurpinar, Emre, and Chowdhury, Md. Shajjad. Tue .  
        "Power module with organic layers".  United States.  https://www.osti.gov/servlets/purl/1986938.

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@article{osti_1986938,

  title        = {Power module with organic layers},

  author       = {Gurpinar, Emre and Chowdhury, Md. Shajjad},

  abstractNote = {A power module is provided with reduced power and gate loop inductance. The power module may be configured in a multi-layer manner with one or more organic substrates.},

  doi          = {},

  journal      = {},
number       = ,

  volume       = ,

  place        = {United States},

  year         = {2022},

  month        = {12}

}

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Works referenced in this record:

Integrated packaging of multiple double sided cooling planar bond power modules
patent, April 2018

Liang, Zhenxian
US Patent Document 9,941,234
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Semiconductor Device
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Komo, Hideo; Omaru, Takeshi; Saito, Shoji
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Power Semiconductor Module
patent-application, February 2009

Bayerer, Reinhold
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Power Semiconductor Packaging Method and Structure
patent-application, December 2008

Fillion, Raymond Albert; Beaupre, Richard Alfred; Elasser, Ahmed
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Semiconductor Device
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Takano, Fumitomo; Watanabe, Shinya; Aiba, Tsukasa
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A Review of SiC Power Module Packaging: Layout, Material System and Integration
journal, September 2017

Chen, Cai
CPSS Transactions on Power Electronics and Applications, Vol. 2, Issue 3
https://doi.org/10.24295/CPSSTPEA.2017.00017

Power module packaging with double sided planar interconnection and heat exchangers
patent, May 2015

Liang, Zhenxian; Marlino, Laura D.; Ning, Puqi
US Patent Document 9,041,183
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Semiconductor Package
patent-application, October 2019

Otsubo, Yoshitaka; Ando, Masayuki; Ohara, Kota
US Patent Application 16/188772; 20190304859
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Integrated double sided cooling packaging of planar SiC power modules
conference, September 2015

Liang, Zhenxian
2015 IEEE Energy Conversion Congress and Exposition (ECCE)
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Encapsulated Stress Mitigation Layer and Power Electronic Assemblies Incorporating the Same
patent-application, April 2020

Joshi, Shailesh N.; Take, Naoya
US Patent Application 16/165635; 20200126946
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20200126946

Power Semiconductor Module
patent-application, April 2015

Tamada, Yoshiko; Oka, Seiji
US Patent Application 14/409301; 20150115288
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20150115288

Power Converter Having a Conductive Clip
patent-application, September 2019

Joshi, Rajeev Dinkar; Mao, Jie
US Patent Application 15/925191; 20190287885
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20190287885

Power Module Based on Multi-Layer Circuit Board
patent-application, December 2018

Mohn, Fabien; Schuderer, Juergen; Traub, Felix
US Patent Application 16/111984; 20180366400
URL: https://image-ppubs.uspto.gov/dirsearch-public/print/downloadPdf/20180366400

Development of Advanced All-SiC Power Modules
journal, May 2014

Liang, Zhenxian; Ning, Puqi; Wang, Fred
IEEE Transactions on Power Electronics, Vol. 29, Issue 5
https://doi.org/10.1109/TPEL.2013.2289395

Electrical Performance Advancement in SiC Power Module Package Design With Kelvin Drain Connection and Low Parasitic Inductance
journal, March 2019

Yang, Fei; Wang, Zhiqiang; Liang, Zhenxian
IEEE Journal of Emerging and Selected Topics in Power Electronics, Vol. 7, Issue 1
https://doi.org/10.1109/JESTPE.2018.2870248

Prognostic System for Power Modules in Converter Systems Using Structure Function
journal, January 2018

Aliyu, Attahir Murtala; Castellazzi, Alberto
IEEE Transactions on Power Electronics, Vol. 33, Issue 1
https://doi.org/10.1109/TPEL.2017.2672823

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Similar Records

Title: Power module with organic layers

Abstract

Citation Formats

Integrated packaging of multiple double sided cooling planar bond power modules patent, April 2018

Semiconductor Device patent-application, August 2016

Power Semiconductor Module patent-application, February 2009

Power Semiconductor Packaging Method and Structure patent-application, December 2008

Semiconductor Device patent-application, October 2009

A Review of SiC Power Module Packaging: Layout, Material System and Integration journal, September 2017

Power module packaging with double sided planar interconnection and heat exchangers patent, May 2015

Semiconductor Package patent-application, October 2019

Integrated double sided cooling packaging of planar SiC power modules conference, September 2015

Encapsulated Stress Mitigation Layer and Power Electronic Assemblies Incorporating the Same patent-application, April 2020

Power Semiconductor Module patent-application, April 2015

Power Converter Having a Conductive Clip patent-application, September 2019

Power Module Based on Multi-Layer Circuit Board patent-application, December 2018

Development of Advanced All-SiC Power Modules journal, May 2014

Electrical Performance Advancement in SiC Power Module Package Design With Kelvin Drain Connection and Low Parasitic Inductance journal, March 2019

Prognostic System for Power Modules in Converter Systems Using Structure Function journal, January 2018

Integrated packaging of multiple double sided cooling planar bond power modules
patent, April 2018

Semiconductor Device
patent-application, August 2016

Power Semiconductor Module
patent-application, February 2009

Power Semiconductor Packaging Method and Structure
patent-application, December 2008

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patent-application, October 2009

A Review of SiC Power Module Packaging: Layout, Material System and Integration
journal, September 2017

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patent-application, October 2019

Integrated double sided cooling packaging of planar SiC power modules
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Encapsulated Stress Mitigation Layer and Power Electronic Assemblies Incorporating the Same
patent-application, April 2020

Power Semiconductor Module
patent-application, April 2015

Power Converter Having a Conductive Clip
patent-application, September 2019

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journal, May 2014

Electrical Performance Advancement in SiC Power Module Package Design With Kelvin Drain Connection and Low Parasitic Inductance
journal, March 2019

Prognostic System for Power Modules in Converter Systems Using Structure Function
journal, January 2018