DOE Patents title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: Combining complex flow manifold with three dimensional woven lattices as a thermal management unit

Abstract

The present invention is directed to a manifold for directing cooling fluid and/or gas to a heat exchanger in a flow configuration designed to optimize heat transfer from the heat exchanger. The manifold can take many different forms such as a layered construction with distributed inlet paths, local outlet paths, a central collection changer and a path for fluid removal. The manifold can be formed from a metal, plastic, rubber, ceramic, or other heat resistant material known to or conceivable by one of skill in the art. The manifold can also be combined with any type of heat exchanger known to or conceivable by one of skill in the art to form a thermal management unit. To optimize overall properties such as low pressure drop, high heat transfer, and excellent temperature uniformity of the thermal management unit, the manifold can be graded, expanded and scaled as needed.

Inventors:
; ; ; ; ; ;
Issue Date:
Research Org.:
Johns Hopkins Univ., Baltimore, MD (United States)
Sponsoring Org.:
USDOE; Defense Advanced Research Projects Agency (DARPA)
OSTI Identifier:
1986738
Patent Number(s):
11480398
Application Number:
15/161,849
Assignee:
The Johns Hopkins University (Baltimore, MD)
DOE Contract Number:  
W91CRB1010004
Resource Type:
Patent
Resource Relation:
Patent File Date: 05/23/2016
Country of Publication:
United States
Language:
English

Citation Formats

Hemker, Kevin J., Weihs, Timothy P., Ryan, Stephen, Zhao, Longyu, Ha, Seunghyun, Zhang, Yong, and Guest, James K. Combining complex flow manifold with three dimensional woven lattices as a thermal management unit. United States: N. p., 2022. Web.
Hemker, Kevin J., Weihs, Timothy P., Ryan, Stephen, Zhao, Longyu, Ha, Seunghyun, Zhang, Yong, & Guest, James K. Combining complex flow manifold with three dimensional woven lattices as a thermal management unit. United States.
Hemker, Kevin J., Weihs, Timothy P., Ryan, Stephen, Zhao, Longyu, Ha, Seunghyun, Zhang, Yong, and Guest, James K. Tue . "Combining complex flow manifold with three dimensional woven lattices as a thermal management unit". United States. https://www.osti.gov/servlets/purl/1986738.
@article{osti_1986738,
title = {Combining complex flow manifold with three dimensional woven lattices as a thermal management unit},
author = {Hemker, Kevin J. and Weihs, Timothy P. and Ryan, Stephen and Zhao, Longyu and Ha, Seunghyun and Zhang, Yong and Guest, James K.},
abstractNote = {The present invention is directed to a manifold for directing cooling fluid and/or gas to a heat exchanger in a flow configuration designed to optimize heat transfer from the heat exchanger. The manifold can take many different forms such as a layered construction with distributed inlet paths, local outlet paths, a central collection changer and a path for fluid removal. The manifold can be formed from a metal, plastic, rubber, ceramic, or other heat resistant material known to or conceivable by one of skill in the art. The manifold can also be combined with any type of heat exchanger known to or conceivable by one of skill in the art to form a thermal management unit. To optimize overall properties such as low pressure drop, high heat transfer, and excellent temperature uniformity of the thermal management unit, the manifold can be graded, expanded and scaled as needed.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2022},
month = {10}
}

Works referenced in this record:

Metal foams as compact high performance heat exchangers
journal, December 2003


Method for Manifold Manufacture and Assembly
patent-application, February 2010


Multi-slab multichannel heat exchanger
patent, May 2011


Keel cooler with fluid flow diverter
patent, February 2013


Heat exchanger
patent, July 2014


Apparatus and method of efficient fluid delivery for cooling a heat producing device
patent, March 2007


Heat exchanger with pressure reduction
patent, December 2012


Apparatus for indirect impingement cooling of integrated circuit chips
patent, March 1994


Apparatus and Method of Forming Channels in a Heat-Exchanging Device
patent-application, September 2004


Experimental research on convection heat transfer in sintered porous plate channels
journal, May 2004


Gas encapsulated cooling module
patent, February 1979


Heat-Exchange Type Cooler
patent-application, May 2006


Evaporator, Manufacturing Method of the Same, Header for Evaporator and Refrigeration System
patent-application, August 2004


Cooling system for an electronic circuit device
patent, April 1990


Interwoven manifolds for pressure drop reduction in microchannel heat exchangers
patent, January 2006


Cooling device
patent, May 2006


Method and Apparatus for Efficient Vertical Fluid Delivery for Cooling a Heat Producing Device
patent-application, September 2005


Microjet array single-phase and flow boiling heat transfer with R134a
journal, November 2010


Refrigerant evaporator
patent, May 2008


Heat Exchanger Header Assembly
patent-application, November 2003


Heat Sink Member for a Semiconductor Device
patent, January 1968


Method and Apparatus for Efficient Vertical Fluid Delivery for Cooling a Heat Producing Device
patent-application, June 2004


Interwoven Manifolds for Pressure Drop Reduction in Microchannel Heat Exchangers
patent-application, September 2005


Battery module
patent, March 2015


Heat exchanger, particularly for a motor vehicle
patent, January 2010


Method of Manufacturing a Heat Exchanger Assembly Having a Sheet Metal Distributor/Collector Tube
patent-application, December 2016


Liquid impingement cooling module for semiconductor devices
patent, December 1993


Radiator
patent, November 1937


Heat Exchanger for Exchanging Heat between Internal Fluid and External Fluid and Manufacturing Method Thereof
patent-application, October 2003


Heat exchanger
patent, December 2009


Heat exchanger
patent, October 1993


Header plate for a heat exchanger, especially for a motor vehicle
patent, February 1999


Heat exchanger
patent, January 1996


Modular Jet Impingement Cooling Apparatuses with Exchangeable Jet Plates
patent-application, July 2014


Heat Exchange Construction
patent, August 1960


Cooling Apparatus, Cooled Electronic Module and Methods of Fabrication Thereof Employing an Integrated Coolant Inlet and Outlet Manifold
patent-application, November 2006


Permeability measurements and modeling of topology-optimized metallic 3-D woven lattices
journal, December 2014


Cooling Apparatuses Having a Jet Orifice Surface with Alternating Vapor Guide Channels
patent-application, July 2014


Thermal conduction module with integral impingement cooling
patent, January 1993


Two piece heat exchanger manifold
patent, November 2003


Heat exchanger and method of fabricating the heat exchanger
patent, June 1998


Method and Apparatus for Flexible Fluid Delivery for Cooling Desired Hot Spots in a Heat Producing Device
patent-application, September 2005