Combining complex flow manifold with three dimensional woven lattices as a thermal management unit
Abstract
The present invention is directed to a manifold for directing cooling fluid and/or gas to a heat exchanger in a flow configuration designed to optimize heat transfer from the heat exchanger. The manifold can take many different forms such as a layered construction with distributed inlet paths, local outlet paths, a central collection changer and a path for fluid removal. The manifold can be formed from a metal, plastic, rubber, ceramic, or other heat resistant material known to or conceivable by one of skill in the art. The manifold can also be combined with any type of heat exchanger known to or conceivable by one of skill in the art to form a thermal management unit. To optimize overall properties such as low pressure drop, high heat transfer, and excellent temperature uniformity of the thermal management unit, the manifold can be graded, expanded and scaled as needed.
- Inventors:
- Issue Date:
- Research Org.:
- Johns Hopkins Univ., Baltimore, MD (United States)
- Sponsoring Org.:
- USDOE; Defense Advanced Research Projects Agency (DARPA)
- OSTI Identifier:
- 1986738
- Patent Number(s):
- 11480398
- Application Number:
- 15/161,849
- Assignee:
- The Johns Hopkins University (Baltimore, MD)
- DOE Contract Number:
- W91CRB1010004
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 05/23/2016
- Country of Publication:
- United States
- Language:
- English
Citation Formats
Hemker, Kevin J., Weihs, Timothy P., Ryan, Stephen, Zhao, Longyu, Ha, Seunghyun, Zhang, Yong, and Guest, James K. Combining complex flow manifold with three dimensional woven lattices as a thermal management unit. United States: N. p., 2022.
Web.
Hemker, Kevin J., Weihs, Timothy P., Ryan, Stephen, Zhao, Longyu, Ha, Seunghyun, Zhang, Yong, & Guest, James K. Combining complex flow manifold with three dimensional woven lattices as a thermal management unit. United States.
Hemker, Kevin J., Weihs, Timothy P., Ryan, Stephen, Zhao, Longyu, Ha, Seunghyun, Zhang, Yong, and Guest, James K. Tue .
"Combining complex flow manifold with three dimensional woven lattices as a thermal management unit". United States. https://www.osti.gov/servlets/purl/1986738.
@article{osti_1986738,
title = {Combining complex flow manifold with three dimensional woven lattices as a thermal management unit},
author = {Hemker, Kevin J. and Weihs, Timothy P. and Ryan, Stephen and Zhao, Longyu and Ha, Seunghyun and Zhang, Yong and Guest, James K.},
abstractNote = {The present invention is directed to a manifold for directing cooling fluid and/or gas to a heat exchanger in a flow configuration designed to optimize heat transfer from the heat exchanger. The manifold can take many different forms such as a layered construction with distributed inlet paths, local outlet paths, a central collection changer and a path for fluid removal. The manifold can be formed from a metal, plastic, rubber, ceramic, or other heat resistant material known to or conceivable by one of skill in the art. The manifold can also be combined with any type of heat exchanger known to or conceivable by one of skill in the art to form a thermal management unit. To optimize overall properties such as low pressure drop, high heat transfer, and excellent temperature uniformity of the thermal management unit, the manifold can be graded, expanded and scaled as needed.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2022},
month = {10}
}
Works referenced in this record:
Metal foams as compact high performance heat exchangers
journal, December 2003
- Boomsma, K.; Poulikakos, D.; Zwick, F.
- Mechanics of Materials, Vol. 35, Issue 12
Method for Manifold Manufacture and Assembly
patent-application, February 2010
- Shah, Suresh Deepchand; Bhatti, Mohinder Singh; Kroetsch, Karl Paul
- US Patent Application 12/221599; 20100031507
Multi-slab multichannel heat exchanger
patent, May 2011
- Knight, John T.; Kopko, William L.; Pickle, Stephen B.
- US Patent Document 7,942,020
Keel cooler with fluid flow diverter
patent, February 2013
- Rericha, Steven; Leeson, Jeffrey S.; Brakey, Michael W.
- US Patent Document 8,376,029
Heat exchanger
patent, July 2014
- Mross, Greg; Engel, Brad; Johnson, Mark
- US Patent Document 8,776,873
Apparatus and method of efficient fluid delivery for cooling a heat producing device
patent, March 2007
- Brewer, Richard Grant; Upadhya, Girish; Zhou, Peng
- US Patent Document 7,188,662
Heat exchanger with pressure reduction
patent, December 2012
- Reynolds, Brian
- US Patent Document 8,322,407
Apparatus for indirect impingement cooling of integrated circuit chips
patent, March 1994
- Young, Steven P.; Acocella, John; Fahey, Albert J.
- US Patent Document 5,294,830
Apparatus and Method of Forming Channels in a Heat-Exchanging Device
patent-application, September 2004
- Kenny, Thomas; McMaster, Mark; Lovette, James
- US Patent Application 10/643684; 20040182560
Experimental research on convection heat transfer in sintered porous plate channels
journal, May 2004
- Jiang, Pei-Xue; Li, Meng; Lu, Tian-Jian
- International Journal of Heat and Mass Transfer, Vol. 47, Issue 10-11
Gas encapsulated cooling module
patent, February 1979
- Meeker, Robert G.; Scanlon, William J.; Segal, Zvi
- US Patent Document 4,138,692
Heat-Exchange Type Cooler
patent-application, May 2006
- Huang, Jung Fong; Huang, Chih Chien
- US Patent Application 11/052029; 20060090888
Hydraulic manifold for water cooling of multi-chip electric modules
patent, July 1988
- Flint, Ephraim B.; Grebe, Kurt R.
- US Patent Document 4,759,403
Evaporator, Manufacturing Method of the Same, Header for Evaporator and Refrigeration System
patent-application, August 2004
- Horiuchi, Hirofumi; Hoshino, Ryoichi; Ogasawara, Noboru
- US Patent Application 10/480259; 20040159121
Cooling system for an electronic circuit device
patent, April 1990
- Yamamoto, Haruhiko; Suzuki, Masahiro; Udagawa, Yoshiaki
- US Patent Document 4,920,574
Interwoven manifolds for pressure drop reduction in microchannel heat exchangers
patent, January 2006
- Upadhya, Girish; Kenny, Thomas W.; Zhou, Peng
- US Patent Document 6,986,382
Method and Apparatus for Efficient Vertical Fluid Delivery for Cooling a Heat Producing Device
patent-application, September 2005
- Kenny, Thomas W.; Munch, Mark; Zhou, Peng
- US Patent Application 10/882132; 20050211418
Integral cooling system for electric components
patent, May 1994
- Messina, Gaetano P.
- US Patent Document 5,309,319
Microjet array single-phase and flow boiling heat transfer with R134a
journal, November 2010
- Browne, Eric A.; Michna, Gregory J.; Jensen, Michael K.
- International Journal of Heat and Mass Transfer, Vol. 53, Issue 23-24
Refrigerant evaporator
patent, May 2008
- Katoh, Yoshiki; Hasegawa, Etsuo; Kawakubo, Masaaki
- US Patent Document 7,367,203
Heat Exchanger Header Assembly
patent-application, November 2003
- Dey, Lavoyce; Fitzgerald, Jonathan; Powers, Michael
- US Patent Application 10/152852; 20030217838
Heat Sink Member for a Semiconductor Device
patent, January 1968
- Meyerhoff, Alfred; Motto, Jr., John W.
- US Patent Document 3361195
Method and Apparatus for Efficient Vertical Fluid Delivery for Cooling a Heat Producing Device
patent-application, June 2004
- Kenny, Thomas W.; Munch, Mark; Zhou, Peng
- US Patent Application 10/698179; 20040112571
Interwoven Manifolds for Pressure Drop Reduction in Microchannel Heat Exchangers
patent-application, September 2005
- Upadhya, Girish; Kenny, Thomas W.; Zhou, Peng
- US Patent Application 10/881980; 20050211417
Battery module
patent, March 2015
- Merriman, Robert; Gadawski, Thomas J.; Payne, Josh
- US Patent Document 8,974,934
Heat exchanger, particularly for a motor vehicle
patent, January 2010
- Demuth, Walter; Kotsch, Martin; Kranich, Michael
- US Patent Document 7,650,935
Method of Manufacturing a Heat Exchanger Assembly Having a Sheet Metal Distributor/Collector Tube
patent-application, December 2016
- Winterstten, Douglas C.; Pautler, Donald R.; Dittly, Bruce W.
- US Patent Application 14/735561; 20160363392
Liquid impingement cooling module for semiconductor devices
patent, December 1993
- Nakajima, Tadakatsu; Ohashi, Shigeo; Kuwahara, Heikichi
- US Patent Document 5,270,572
Heat Exchanger for Exchanging Heat between Internal Fluid and External Fluid and Manufacturing Method Thereof
patent-application, October 2003
- Kawakubo, Masaaki; Muto, Ken; Kawachi, Norihide
- US Patent Application 10/405433; 20030188857
Heat exchanger
patent, December 2009
- Park, Taeyoung; Oh, Kwangheon; Lee, Duckho
- US Patent Document 7,637,314
Header plate for a heat exchanger, especially for a motor vehicle
patent, February 1999
- Letrange, Frederic; Martins, Carlos
- US Patent Document 5,873,409
Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device
patent, January 2006
- Kenny, Thomas W.; Munch, Mark; Zhou, Peng
- US Patent Document 6,988,534
Modular Jet Impingement Cooling Apparatuses with Exchangeable Jet Plates
patent-application, July 2014
- Joshi, Shailesh N.; Dede, Ercan Mehmet; Rau, Matthew Joseph
- US Patent Application 13/734615; 20140190665
Cooling Apparatus, Cooled Electronic Module and Methods of Fabrication Thereof Employing an Integrated Coolant Inlet and Outlet Manifold
patent-application, November 2006
- Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.
- US Patent Application 11/124513; 20060250774
Permeability measurements and modeling of topology-optimized metallic 3-D woven lattices
journal, December 2014
- Zhao, Longyu; Ha, Seunghyun; Sharp, Keith W.
- Acta Materialia, Vol. 81
Steam coil with alternating row opposite end feed
patent, June 1994
- Roberts, Thomas
- US Patent Document 5,323,850
Cooling Apparatuses Having a Jet Orifice Surface with Alternating Vapor Guide Channels
patent-application, July 2014
- Joshi, Shailesh N.; Kuhlmann, Joshua Sean; Rau, Matthew Joseph
- US Patent Application 13/734635; 20140190668
Thermal conduction module with integral impingement cooling
patent, January 1993
- Graham, Nadia H.; Moran, Kevin P.
- US Patent Document 5,177,667
Heat exchanger for exchanging heat between internal fluid and external fluid and manufacturing method thereof
patent, December 2004
- Kawakubo, Masaaki; Muto, Ken; Kawachi, Norihide
- US Patent Document 6,827,139
Two piece heat exchanger manifold
patent, November 2003
- Abell, Bradley; Gibbons, Richard
- US Patent Document 6,640,887
Heat exchanger and method of fabricating the heat exchanger
patent, June 1998
- Ikejima, Kaoru; Gotoh, Takashi; Yumikura, Tsuneo
- US Patent Document 5,769,157
Method and Apparatus for Flexible Fluid Delivery for Cooling Desired Hot Spots in a Heat Producing Device
patent-application, September 2005
- Kenny, Thomas W.; Munch, Mark; Zhou, Peng
- US Patent Application 10/882142; 20050211427