3D structures and methods therefor
Abstract
Aspects of the disclosure are directed to methods and/or apparatuses involving one or more of a conductive polymer, deposition of a conductive polymer and 3D (three-dimensional) printing of a continuous bead of material. As may be implemented in accordance with one or more embodiments characterized herein, a 3D structure is formed as follows. A stacked layer is formed by depositing a continuous bead of material along an uninterrupted path that defines a first layer of the 3D structure. A sidewall of the 3D structure is formed with opposing surfaces respectively defined by successive stacked layers of the 3D structure by, for each stacked layer (including the first layer), depositing the continuous bead of material along the path and with a surface thereof in contact with a surface of the continuous bead of material of an adjacent one of the stacked layers.
- Inventors:
- Issue Date:
- Research Org.:
- Univ. of Wisconsin, Madison, WI (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1925137
- Patent Number(s):
- 11453158
- Application Number:
- 16/193,733
- Assignee:
- Wisconsin Alumni Research Foundation (Madison, WI)
- Patent Classifications (CPCs):
-
B - PERFORMING OPERATIONS B22 - CASTING B22F - WORKING METALLIC POWDER
B - PERFORMING OPERATIONS B23 - MACHINE TOOLS B23P - OTHER WORKING OF METAL
- DOE Contract Number:
- AR0000573
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 11/16/2018
- Country of Publication:
- United States
- Language:
- English
Citation Formats
Nellis, Gregory, Boxleitner, Jake, and Mulholland, Thomas. 3D structures and methods therefor. United States: N. p., 2022.
Web.
Nellis, Gregory, Boxleitner, Jake, & Mulholland, Thomas. 3D structures and methods therefor. United States.
Nellis, Gregory, Boxleitner, Jake, and Mulholland, Thomas. Tue .
"3D structures and methods therefor". United States. https://www.osti.gov/servlets/purl/1925137.
@article{osti_1925137,
title = {3D structures and methods therefor},
author = {Nellis, Gregory and Boxleitner, Jake and Mulholland, Thomas},
abstractNote = {Aspects of the disclosure are directed to methods and/or apparatuses involving one or more of a conductive polymer, deposition of a conductive polymer and 3D (three-dimensional) printing of a continuous bead of material. As may be implemented in accordance with one or more embodiments characterized herein, a 3D structure is formed as follows. A stacked layer is formed by depositing a continuous bead of material along an uninterrupted path that defines a first layer of the 3D structure. A sidewall of the 3D structure is formed with opposing surfaces respectively defined by successive stacked layers of the 3D structure by, for each stacked layer (including the first layer), depositing the continuous bead of material along the path and with a surface thereof in contact with a surface of the continuous bead of material of an adjacent one of the stacked layers.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2022},
month = {9}
}
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