Multi-device cooling structure having assembly alignment features
Abstract
A single device having both thermal and alignment features is provided to mechanically align and more efficiently cool multiple heat generating components. The device includes one or more thermal structures and assembly alignment features, in which the one or more thermal structures make thermal contact with a plurality of heat generating components. The assembly alignment features control the positions of the heat generating components during assembly of the heat generating components onto a common substrate.
- Inventors:
- Issue Date:
- Research Org.:
- Lawrence Livermore National Laboratory (LLNL), Livermore, CA (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1925085
- Patent Number(s):
- 11439043
- Application Number:
- 16/416,991
- Assignee:
- International Business Machines Corporation (Armonk, NY)
- Patent Classifications (CPCs):
-
G - PHYSICS G06 - COMPUTING G06F - ELECTRIC DIGITAL DATA PROCESSING
H - ELECTRICITY H01 - BASIC ELECTRIC ELEMENTS H01L - SEMICONDUCTOR DEVICES
- DOE Contract Number:
- AC52-07NA27344
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 05/20/2019
- Country of Publication:
- United States
- Language:
- English
- Subject:
- 47 OTHER INSTRUMENTATION; 42 ENGINEERING
Citation Formats
Tian, Shurong, Takken, Todd E., and McAuliffe, Liam. Multi-device cooling structure having assembly alignment features. United States: N. p., 2022.
Web.
Tian, Shurong, Takken, Todd E., & McAuliffe, Liam. Multi-device cooling structure having assembly alignment features. United States.
Tian, Shurong, Takken, Todd E., and McAuliffe, Liam. Tue .
"Multi-device cooling structure having assembly alignment features". United States. https://www.osti.gov/servlets/purl/1925085.
@article{osti_1925085,
title = {Multi-device cooling structure having assembly alignment features},
author = {Tian, Shurong and Takken, Todd E. and McAuliffe, Liam},
abstractNote = {A single device having both thermal and alignment features is provided to mechanically align and more efficiently cool multiple heat generating components. The device includes one or more thermal structures and assembly alignment features, in which the one or more thermal structures make thermal contact with a plurality of heat generating components. The assembly alignment features control the positions of the heat generating components during assembly of the heat generating components onto a common substrate.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2022},
month = {9}
}
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