Heat transfer device having an enclosure and a non-permeable barrier inside the enclosure
Abstract
A heat transfer device includes a hollow spacer between opposed substrates, defining an enclosure, at least one of the substrates adapted to be secured to at least one heat source. A non-permeable barrier is in the enclosure between the substrates. A first chamber inside the enclosure is defined by the spacer, the substrates, and the barrier, the first chamber in fluid communication with at least one first inlet and first outlet. A second chamber inside the enclosure and outside the first chamber and is defined by the spacer, the substrates, and the barrier, the second chamber in fluid communication with at least one second outlet. A wick structure is secured to at least one substrate, a first portion of the wick structure in the first chamber, and a second portion of the wick structure in the second chamber and interconnecting in passive liquid communication with the first portion.
- Inventors:
- Issue Date:
- Research Org.:
- Advanced Cooling Technologies, Inc., Lancaster, PA (United States)
- Sponsoring Org.:
- USDOE
- OSTI Identifier:
- 1924966
- Patent Number(s):
- 11408683
- Application Number:
- 17/003,539
- Assignee:
- Advanced Cooling Technologies, Inc. (Lancaster, PA)
- Patent Classifications (CPCs):
-
F - MECHANICAL ENGINEERING F28 - HEAT EXCHANGE IN GENERAL F28D - HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
F - MECHANICAL ENGINEERING F28 - HEAT EXCHANGE IN GENERAL F28F - DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- DOE Contract Number:
- SC0018845
- Resource Type:
- Patent
- Resource Relation:
- Patent File Date: 08/26/2020
- Country of Publication:
- United States
- Language:
- English
Citation Formats
Shaeri, Mohammad Reza, Bonner, III, Richard W., Ellis, Michael C., Seber, Elizabeth K., and Demydovych, Maksym V. Heat transfer device having an enclosure and a non-permeable barrier inside the enclosure. United States: N. p., 2022.
Web.
Shaeri, Mohammad Reza, Bonner, III, Richard W., Ellis, Michael C., Seber, Elizabeth K., & Demydovych, Maksym V. Heat transfer device having an enclosure and a non-permeable barrier inside the enclosure. United States.
Shaeri, Mohammad Reza, Bonner, III, Richard W., Ellis, Michael C., Seber, Elizabeth K., and Demydovych, Maksym V. Tue .
"Heat transfer device having an enclosure and a non-permeable barrier inside the enclosure". United States. https://www.osti.gov/servlets/purl/1924966.
@article{osti_1924966,
title = {Heat transfer device having an enclosure and a non-permeable barrier inside the enclosure},
author = {Shaeri, Mohammad Reza and Bonner, III, Richard W. and Ellis, Michael C. and Seber, Elizabeth K. and Demydovych, Maksym V.},
abstractNote = {A heat transfer device includes a hollow spacer between opposed substrates, defining an enclosure, at least one of the substrates adapted to be secured to at least one heat source. A non-permeable barrier is in the enclosure between the substrates. A first chamber inside the enclosure is defined by the spacer, the substrates, and the barrier, the first chamber in fluid communication with at least one first inlet and first outlet. A second chamber inside the enclosure and outside the first chamber and is defined by the spacer, the substrates, and the barrier, the second chamber in fluid communication with at least one second outlet. A wick structure is secured to at least one substrate, a first portion of the wick structure in the first chamber, and a second portion of the wick structure in the second chamber and interconnecting in passive liquid communication with the first portion.},
doi = {},
journal = {},
number = ,
volume = ,
place = {United States},
year = {2022},
month = {8}
}
Save to My Library
You must Sign In or Create an Account in order to save documents to your library.
Works referenced in this record:
Capillary-pumped heat transfer panel and system
patent, July 1986
- Edelstein, Fred; Haslett, Robert A.; Kosson, Robert L.
- US Patent Document 4,602,679
Evaporator and loop-type heat pipe using the same
patent, December 2001
- Ogushi, Tetsurou; Murakami, Masaaki; Yao, Akira
- US Patent Document 6,330,907
Hybrid capillary cooling apparatus
patent, January 2006
- Zuo, Jon; Sarraf, David Bruce
- US Patent Document 6,990,816
Apparatus and method of efficient fluid delivery for cooling a heat producing device
patent, March 2007
- Brewer, Richard Grant; Upadhya, Girish; Zhou, Peng
- US Patent Document 7,188,662
Heat transferring device having adiabatic unit
patent-application, May 2003
- Son, Sang-Young; Choi, Mun-Cheol; Hong, Young-Ki
- US Patent Application 10/259877; 20030079865
Hybrid loop cooling of high powered devices
patent, September 2005
- Anderson, William G.; Eastman, G. Yale; Sarraf, David Bruce
- US Patent Document 6,948,556
Multi-stage Hybrid Evaporative Cooling System
patent-application, May 2007
- Schlom, Leslie A.; Becwar, Andrew J.
- US Patent Application 11/269431; 20070101746
Evaporator with simplified assembly for diphasic loop
patent-application, May 2016
- De Troz, Vincent
- US Patent Application 14/903272; 20160131438
Multi-phase thermal control apparatus, evaporators and methods of manufacture thereof
patent-application, February 2018
- Roberts, Scott N.; Mastropietro, Arthur J.; Furst, Benjamin I.
- US Patent Application 15/666217; 20180031330